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Low Temperature Tensile and Shear/Tension Properties of Composite Materials with Electrically Insulating Barrier Films

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Advances in Cryogenic Engineering Materials

Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 44))

Abstract

New advances in surface treatments to electrically insulating polymeric films have improved the ability of resins to bond with these materials. This paper evaluates the strength of these bonds at low temperatures in transverse tension and combined shear/tension using a specimen geometry designed to minimise stress raisers from discontinuities in the specimen. Bond strengths of 100 to 150 MPa are reported.

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References

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Author information

Authors and Affiliations

  1. Rutherford Appleton Laboratory, Council for the Central Laboratory of the Research Councils, Chilton, Didcot, Oxon, OX 11 0QX, UK

    D. E. Baynham, D. Evans, S. J. Gamage, D. Morrow & S. J. Robertson

Authors
  1. D. E. Baynham
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  2. D. Evans
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  3. S. J. Gamage
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  4. D. Morrow
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  5. S. J. Robertson
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Editor information

Editors and Affiliations

  1. Argonne National Laboratory, Argonne, Illinois, USA

    U. Balu Balachandran

  2. Naval Research Laboratory, Washington, D.C., USA

    Donald G. Gubser

  3. Texas A&M University, College Station, Texas, USA

    K. Ted Hartwig

  4. Cryogenic Materials, Inc., Boulder, Colorado, USA

    Richard P. Reed

  5. Oregon State University, Corvallis, Oregon, USA

    William H. Warnes

  6. Synchrony, Bordentown, New Jersey, USA

    Victoria A. Bardos

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© 1998 Springer Science+Business Media New York

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Baynham, D.E., Evans, D., Gamage, S.J., Morrow, D., Robertson, S.J. (1998). Low Temperature Tensile and Shear/Tension Properties of Composite Materials with Electrically Insulating Barrier Films. In: Balachandran, U.B., Gubser, D.G., Hartwig, K.T., Reed, R.P., Warnes, W.H., Bardos, V.A. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering, vol 44. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9056-6_26

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  • DOI: https://doi.org/10.1007/978-1-4757-9056-6_26

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9058-0

  • Online ISBN: 978-1-4757-9056-6

  • eBook Packages: Springer Book Archive

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