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Fracture Toughness and Relaxation of Epoxy Resins at Cryogenic Temperatures

  • Fumio Sawa
  • Shigehiro Nishijima
  • Yuichi Ohtani
  • Kenichi Matsushita
  • Toichi Okada
Part of the An International Cryogenic Materials Conference Publication book series (ACRE, volume 40)

Abstract

The relationship between fracture toughness and several epoxy resins has been investigated at cryogenic temperatures. Resins for cryogenic use are thought to require high fracture toughness at cryogenic temperatures. The fracture toughness and mechanical and dielectric relaxation of resins were studied at low temperature. The amount of plasticizer and molecular weight between crosslinks was varied. It was found that the fracture toughness had a close relation to the relaxation behavior, and hence, the effect of plasticizer disappeared at liquid helium temperature. The resin with larger epoxide equivalent had a higher fracture toughness even at liquid helium temperature. This suggests a guideline for the molecular design for the resin with high fracture toughness at cryogenic temperature.

Keywords

Fracture Toughness Dielectric Loss Internal Friction Tertiary Amine Dielectric Relaxation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1994

Authors and Affiliations

  • Fumio Sawa
    • 1
  • Shigehiro Nishijima
    • 1
  • Yuichi Ohtani
    • 1
  • Kenichi Matsushita
    • 1
  • Toichi Okada
    • 1
  1. 1.ISIROsaka UniversityIbaraki, Osaka 567Japan

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