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Materials pp 69-76 | Cite as

Vamas Second Round Robin Test of Structural Materials at Liquid Helium Temperature

  • T. Ogata
  • K. Nagai
  • K. Ishikawa
  • K. Shibata
  • S. Murase
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 38)

Abstract

A second international round robin(RR) tensile and fracture toughness test program at liquid helium temperature has been coordinated under the Versailles Project on Advanced Materials and Standards (VAMAS). This RR-test was carried out in order to refine procedures of the tests and clarify remaining problems, so that some testing conditions were limited. The results were considerably improved compared to the those in first RR-test; average yield strength was 1065 MPa with a standard deviation of 15 MPa (1.4% to the average) and fracture toughness was 263 MPa√m with a standard deviation of 15.3 MPa√m(5.8%).

Keywords

Fracture Toughness Round Robin Fracture Toughness Test Liquid Helium Temperature Initial Crack Length 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    K. Nagai, T. Ogata, K. Ishikawa, K. Shibata, and E. Fukushima, VAMAS Interlaboratory Tensile Test at Liquid Helium Temperature, Cryogenic Materials 88, 2: 893-900 (1988)Google Scholar
  2. 2.
    T. Ogata, K. Nagai, K. Ishikawa, K. Shibata, and E. Fukushima, VAMAS Interlaboratory Fracture Toughness Test at Liquid Helium Temperature, Adv. Cryo. Eng. 36:1053-1060(19 90)Google Scholar
  3. 3.
    Standard Test Method for J1, A Measure of Fracture Toughness, Designation E 813-81, 1986 Annual Book if ASTM Standards, Vol. 03.01, Amer. Soc. Test. Maters., Philadelphia (1986)Google Scholar
  4. 4.
    H. Nakajima, Y. Yoshida, S. Shimamoto, R. L. Tobler, R. P. Reed, R. P. Walsh, and P. T. Purtsher, Interlaboratory Tensionand Fracture Toughnes Test Resultsfor CSUS-JN1 austenituc Stainless Steel at 4K, Adv. Cryo. Eng. 368: 1069 - 1076 (1990)Google Scholar

Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • T. Ogata
    • 1
  • K. Nagai
    • 1
  • K. Ishikawa
    • 1
  • K. Shibata
    • 2
  • S. Murase
    • 3
  1. 1.Tsukuba Labs.National Research Institute for MetalsIbaraki 305Japan
  2. 2.The University of TokyoTokyoJapan
  3. 3.Toshiba Corp.KanagawaJapan

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