Materials pp 117-126 | Cite as

Creep of Indium at Low Temperatures

  • R. P. Reed
  • R. P. Walsh
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 38)

Abstract

Creep tests were conducted on indium at 4 and 76 K for periods of up to one week. The initial creep strain depended on the square of the applied stress. Within this time period, conditions approaching steady-state rates were observed. Steady-state creep strain rates depended strongly on applied stress and temperature. Empirical relations were developed to predict total creep strain and strain rate as a function of temperature and stress. The activation energy obtained by assuming similar creep-deformation mechanisms at 4 and 76 K was much lower than the activation energy for self-diffusion.

Keywords

Nickel Migration Manganese Mold Helium 

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Copyright information

© Springer Science+Business Media New York 1992

Authors and Affiliations

  • R. P. Reed
    • 1
  • R. P. Walsh
    • 1
  1. 1.Materials Reliability DivisionNational Institute of Standards and TechnologyBoulderUSA

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