Creep of Indium at Low Temperatures
Creep tests were conducted on indium at 4 and 76 K for periods of up to one week. The initial creep strain depended on the square of the applied stress. Within this time period, conditions approaching steady-state rates were observed. Steady-state creep strain rates depended strongly on applied stress and temperature. Empirical relations were developed to predict total creep strain and strain rate as a function of temperature and stress. The activation energy obtained by assuming similar creep-deformation mechanisms at 4 and 76 K was much lower than the activation energy for self-diffusion.
KeywordsNickel Migration Manganese Mold Helium
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