Thermal Resistance Across a Copper/Kapton/Copper Interface at Cryogenic Temperatures

  • L. Zhao
  • P. E. Phelan
  • R. C. Niemann
  • B. R. Weber
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 43)

Abstract

The high-Tc superconductor current lead heat intercept connection, which is utilized as a thermal intercept to remove the Joule heat from the upper stage lead to a heat sink operating at 50 – 77 K, consists of a structure where a 152-µm film is sandwiched between two concentric copper cylinders. The material chosen for the insulating film is Kapton MT,* a composite film which has a relatively low thermal resistance, but yet a high voltage standoff capability. Here, the measured thermal conductance of a copper/Kapton MT/copper junction in a flat-plate geometry is compared to the results obtained from the actual heat intercept connection. Increasing the contact pressure reduces the thermal resistance to a minimum value determined by the film conduction resistance. A comparison between the resistance of the copper/Kapton MT/copper junction and a copper/G-10/copper junction demonstrates that the Kapton MT layer yields a lower thermal resistance while still providing adequate electrical isolation.

Keywords

Nickel Helium Polyimide Bali 

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Copyright information

© Springer Science+Business Media New York 1998

Authors and Affiliations

  • L. Zhao
    • 1
  • P. E. Phelan
    • 1
  • R. C. Niemann
    • 2
  • B. R. Weber
    • 3
  1. 1.Department of Mechanical & Aerospace EngineeringArizona State UniversityTempeUSA
  2. 2.Argonne National LaboratoryArgonneUSA
  3. 3.Superconductivity, Inc.MadisonUSA

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