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Cryopackaging for Real World Products

  • G. Lehmann
  • J. Ramsden
  • J. Sochor
  • G. Beeck
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 43)

Abstract

Wireless products employing high temperature superconductors (HTS) and cryoelectronics are being sold in the commercial and military marketplace. Product requirements for reliability and cost are driving the configuration of the cryopackage. Engineering challenges for vacuüm life, cryocooler reliability, cryoelectronics reliability, and HTS device reliability must be met within cost goals for the products to be viable in the long term. This paper discusses requirements and design approaches for wireless device cryopackaging.

Keywords

High Temperature Superconductor Thermal Performance Military Application Heat Leak Power Spectral Density Analysis 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1998

Authors and Affiliations

  • G. Lehmann
    • 1
  • J. Ramsden
    • 1
  • J. Sochor
    • 1
  • G. Beeck
    • 1
  1. 1.ConductusSunnyvaleUSA

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