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Micromachining Using Porous Silicon

  • Gerhard Lammel
  • Sandra Schweizer
  • Philippe Renaud
Part of the Microsystems book series (MICT, volume 14)

Abstract

Porous silicon was proposed since 1994 for micromachining, but at first only for sacrificial layers [193–198]. Lehmann considered it as new base material for MEMS using the high internal surface of macropores in 1996 [228]. Tjerkstra combined porosification and electropolishing of Si to form free-standing layers of porous Si to separate concentric microchannels [229] and uses isotropic electropolishing to micromachine buried microchannels [230]. All the devices have in common that they are mechanically static.

Keywords

Porous Silicon Optical Filter Electrochemical Etching Filter Plate Mask Level 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2002

Authors and Affiliations

  • Gerhard Lammel
    • 1
  • Sandra Schweizer
    • 1
  • Philippe Renaud
    • 1
  1. 1.Swiss Federal Institute of Technology LausanneEPFLSwitzerland

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