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Feasibility analysis and conclusions

  • Josep Altet
  • Antonio Rubio
Chapter

Abstract

In foregoing chapters the fundamentals of heat propagation laws and analysis tools, in addition to the nature of the heat sources in IC’s and their relation to the presence of failures have been introduced. Use of temperature as a test observable, its advantages and disadvantages as a complementary test procedure and the various methods of temperature measurement have also been presented.

Keywords

Heat Source Logic Transition Logic Gate Monitoring Point Test Vector 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    Altet, J., Rubio, A., Tamamoto, H., “Analysis of the Feasibility of Dynamic Thermal Testing in Digital Circuits,” 6th Asian Test Symposium ATS. pp. 149–154.Google Scholar
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    Tamamoto, H., Saito, M., Rubio, A., Altet, J., “Test Pattern Generation for Thermal Testing,” Proc. European Test Workshop 1998, pp. 101–102.Google Scholar
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    Abramovici, M., Breuer, M.A.M., Briedman, A.D., “Digital System Testing and Testable Design, Computer Science Press, 1990.Google Scholar

Copyright information

© Springer Science+Business Media Dordrecht 2002

Authors and Affiliations

  • Josep Altet
    • 1
  • Antonio Rubio
    • 1
  1. 1.University Politècnia de CatalunyaSpain

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