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Temperature as a test observable variable in ICs

Thermal testing
  • Josep Altet
  • Antonio Rubio
Chapter

Abstract

Temperature is a physical magnitude that has been used as a parametric test observable for IC’s in different scenarios. In the 1990’s, the strategies that used temperature as a test observable were generically termed thermal testing techniques. Thermal testing can be defined as the use of temperature measuring techniques for the detection of structural defects in an IC. Such defects include structural problems in the topology of the microelectronic circuit, or the package structure (which comprises the package itself, but also the soldering integrity with the PCB and the cooling mechanisms, such as fans or radiators). In Chapter 1 the first set of defects was termed intrinsic defects, whereas the second set of defects was referred to as extrinsic defects.

Keywords

Heat Source Solder Joint Monitoring Point Thermal Disturbance Thermal Capacitance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media Dordrecht 2002

Authors and Affiliations

  • Josep Altet
    • 1
  • Antonio Rubio
    • 1
  1. 1.University Politècnia de CatalunyaSpain

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