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Thermal analysis in integrated circuits

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Thermal Testing of Integrated Circuits

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Abstract

The goal of this chapter is to present different techniques to obtain temperature maps or temperature waveforms at certain areas or points of an integrated circuit (IC). The data we need to perform this analysis are: description of the physical structure of the IC, thermal properties of the materials from which it is made, placement of the devices that act as heat sources, description of its power consumption waveform and, finally, the thermal conditions of the IC’s surroundings, which will determine what we will call the boundary conditions.

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Authors and Affiliations

  1. University Politècnia de Catalunya, Spain

    Josep Altet & Antonio Rubio

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  1. Josep Altet
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  2. Antonio Rubio
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© 2002 Springer Science+Business Media Dordrecht

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Altet, J., Rubio, A. (2002). Thermal analysis in integrated circuits. In: Thermal Testing of Integrated Circuits. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3635-9_3

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  • DOI: https://doi.org/10.1007/978-1-4757-3635-9_3

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5287-5

  • Online ISBN: 978-1-4757-3635-9

  • eBook Packages: Springer Book Archive

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