Abstract
With mixed-signal designs becoming more complex and time-to-market windows shrinking, designers cannot hope to keep up unless they change the way they design. They must adopt a more formal process for design and verification: top-down design. It involves more than simply a cursory design of the circuit block diagram before designing the blocks. Rather, it also involves developing and following a formal verification plan and an incremental and methodical approach for transforming the design from a abstract block diagram to a detailed transistor-level implementation.
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Bibliography
C. Force, T. Austin. Testing the design: the evolution of test simulation. International Test Conference, Washington 1998.
C. Force. Integrating design and test using new tools and techniques. Integrated System Design, February 1999.
Dantes virtual test environment, http://www.virtualtest.com.
Matlab and Simulink, http://www.mathworks.com.
Signal-Processing Worksystem User’s Guide. Cadence Design Systems, San Jose, CA.
SpectreVX and SaberVX virtual test environments, http://www.teradyne.com.
Verilog-AMS Language Reference Manual: Analog and Mixed-Signal Extensions to Verilog HDL,version 2.0. Open Verilog International, 2000. Available from http://www.ovi.org.
VHDL-AMS, http://www.vhdl.org/analog/analog.
VHDL-AMS simulators, http://www.vhdl-ams.com
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© 2000 Springer Science+Business Media New York
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Kundert, K. (2000). Top-Down Design of Mixed-Signal Circuits. In: van de Plassche, R.J., Huijsing, J.H., Sansen, W. (eds) Analog Circuit Design. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3198-9_9
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DOI: https://doi.org/10.1007/978-1-4757-3198-9_9
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4419-5002-4
Online ISBN: 978-1-4757-3198-9
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