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Mixed-Mode Telecom Design

  • Domine M. W. Leenaerts
  • Peter W. H. de Vreede

Abstract

This contribution will concentrate on several aspects of mixed-mode telecommunication design. Currently, a strong focus on single chip realisations of relatively simple wireless standards like Bluetooth can be foreseen. However, integrating RF, mixed signal and digital baseband on a single die will confront the designer with design aspects he did normally not take into account.

Keywords

Clock Frequency Guard Ring Current Spike Substrate Noise Decimation Filter 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    J. Fenk, ‘Highly integrated RF-ICs for GSM, DECT, and UMTS Systems, A Status Review and Development Trends’, proc. ESSCIRC’99, pp. 11–14, 1999Google Scholar
  2. 2.
    G. Weinberger,‘ The new millennium: Wireless Technologies for a truly Mobile Society’, Digest ISSCC 2000, pp. 11, 2000Google Scholar
  3. 3.
    J.P. Tsividis, Operation and Modeling of the MOS transistor, Mc Graw Hill Book Co. New York, 1987Google Scholar
  4. 4.
    A.J. Scholten, et.al. Scholten, et.al. ‘A large signalnon-quasi-static MOS model for RF circuit simulation’, IEDM-99, pp. 163–166, 1999Google Scholar
  5. 5.
    L.F. Tiemeijer, ‘RF CMOS modeling’, AACD, 1999Google Scholar
  6. 6.
    M. van Heijningen, et.al. ‘Modeling of Digital Substrate Noise Generation and Experimental Verification Using a Novel substrate Noise Sensor’, proc. ESSCIRC’99, pp.186–189, 1999 DuisburgGoogle Scholar
  7. 7.
    M. Felder, J. Ganger, ‘Analysis of Ground–Bounce Induced Substrate Noise Coupling in a Low Resistive Bulk Epitaxial Process: Design Strategies to Minimize Noise Effects on a Mixed–Signal Chip’, IEEE Trans. Circ. Syst.–II, vol. 46, pp.14–27–1436, 1999Google Scholar
  8. 8.
    B. Nauta, G. Hoogzaad, ‘Substrate Bounce in Mixed-Mode CMOS ICs’, AACD’98 DenmarkGoogle Scholar
  9. 9.
    X. Aragones, A. Rubio, ‘Experimental comparison of substrate noise coupling using different wafer types,’ IEEE Trans. Solid-State Circuits, vol. 34, no. 10,pp 1405–1409, 1999.CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 2000

Authors and Affiliations

  • Domine M. W. Leenaerts
    • 1
  • Peter W. H. de Vreede
    • 1
  1. 1.Philips Research LaboratoriesEindhovenThe Netherlands

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