Abstract
This paper aims to present a brief introduction to the topic of thermal and mechanical problems in microelectronics, specifically packaged devices. A description of typical reliability concerns at component and PCB level is given and the effects of temperature on the reliability of microelectronics devices are outlined. The origin of thermomechanically induced stresses is explained and finally, future technology requirements facing the assembly and packaging community are described and possible solutions are introduced.
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© 2000 Springer Science+Business Media Dordrecht
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Slattery, O.F., Kelly, G., Greer, J. (2000). Thermal and Mechanical Problems in Microelectronics. In: Zhang, G.Q., Ernst, L.J., de Saint Leger, O. (eds) Benefiting from Thermal and Mechanical Simulation in Micro-Electronics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3159-0_2
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DOI: https://doi.org/10.1007/978-1-4757-3159-0_2
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4419-4873-1
Online ISBN: 978-1-4757-3159-0
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