Abstract
This chapter reviews the different methods put forward in the literature for modeling the substrate. The first methods started from a very detailed description of the substrate and the layout, which allowed accurate and flexible modeling of all kinds of technologies and devices, and simple equivalent models were then obtained by numerical techniques. These methods are computationally very demanding, and some of them even follow the pattern of conventional device simulators. Successive model generations have added certain simplifications and have included preprocessing techniques to allow reducing computation requirements, but in spite of this fact such models do not turn out to be very efficient in very complex circuits. In the last few years simpler and less demanding modeling techniques have been sought for. Most of these methods are based on modeling the substrate as a mesh of resistances between neighboring devices or contacts. These resistances are obtained in many cases from semi-empirical expressions that make an estimation from geometrical parameters and technology-dependent fitting constants.
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Aragonès, X., González, J.L., Rubio, A. (1999). Substrate coupling modeling. In: Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-3013-5_3
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DOI: https://doi.org/10.1007/978-1-4757-3013-5_3
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