Substrate noise characteristics and propagation
This chapter contains an exhaustive attempt to reveal the elementary characteristics of substrate coupling. The aim of this part is to determine how coupling is affected by factors such as the type of wafer, the type of coupled devices, the biasing of these devices, and layout and technology parameters.
The chapter starts with a description of the mechanisms by which circuit nodes interact with the substrate. Next, the way device characteristics layout and technology parameters, device type and biasing- affect coupling is studied with device simulations and experimental measurements. Lastly, we analyze the way noise propagation is affected by the substrate type or particular biasing, assuming ideal grounding conditions. In following chapters the consequences of non-ideal supplies on the results obtained will be analyzed.
KeywordsBipolar Transistor NMOS Transistor Guard Ring Return Path Sensitive Device
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- The PN Junction Diode, 2a ed., Gerald W. Neudeck, Addison Wesley Publishing Co., 1989.Google Scholar
- Simultaneous Switching Noise of CMOS Devices and Systems, R. Senthinathan, J.L. Prince, Kluwer Academic Publishers, 1994.Google Scholar
- A. Pun, T. Yeung, J. Lau, F.R. Clement, D. Su, “Experimental Results and Simulation of Substrate Noise Coupling via Planar Spiral Inductor in RF IC’s”, Proc. IEEE Int. Electron Devices Meeting, 1997.Google Scholar
- T. Yeung, A. Pun, Z. Chen, J. Lau, F.J.R. Clément, “Noise Coupling in Heavily and Lightly Doped Substrate from Planar Spiral Inductor”, Proc. IEEE International Symposium on Circuits and Systems, pp. 1405–1408, June 1997.Google Scholar
- Principles of CMOS VLSI Design: A Systems Perspective, 2nd edition, Neil H.E. Weste, Kamran Eshraghian, Addison-Wesley, 1992.Google Scholar
- R.B. Merrill, W.M. Young, K. Brehmer, “Effect of Substrate Material in Mixed Analog/Digital Integrated Circuits”, Proc. IEEE International Electron Devices Meeting, pp. 433–436, San Francisco, December 1994.Google Scholar
- MEDICI, a two dimensional device simulator program, Technology Modeling Associated, Inc. (TMA), Palo Alto, CA, 1993.Google Scholar
- M.J. Loinaz, D.K.Su, B.A. Wooley, “Experimental Results and Modeling Techniques for Substrate Noise in Mixed-Signal Integrated Circuits”, Symposium on VLSI Circuits Digest of Technical Papers, pp. 40–41, 1992.Google Scholar
- Fields and Waves in Communication Electronics, S. Ramo, J.R. Whinnery, T. van Duzer, John Wiley & Sons, 1984.Google Scholar
- RAPHAEL, an Interconnect Analysis Program, Technology Modeling Associated, Inc. (TMA), Palo Alto, CA, 1994.Google Scholar
- P. Basedau, Q. Huang, “A Post Processing Method for Reducing Substrate Coupling in Mixed-Signal Integrated Circuits”, Proc. Symposium on VLSI Circuits, pp. 41–42, 1995.Google Scholar
- N.K. Verghese, D.J. Allstot, S. Masui, “Rapid Simulation of Substrate Coupling Effects in Mixed-Mode ICs”, Proc. IEEE Custom Integrated Circuits Conference, pp. 18.3.1–18.3.4, 1993.Google Scholar