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Modeling Noise Coupling in Mixed-Signal/RF ICs

  • Nishath K. Verghese

Abstract

This paper reviews modeling techniques for noise coupling in mixed-signal/RF integrated circuits. Mixed-signal noise coupling is detrimental to integrated circuit performance, particularly in wireless RF circuits as it can swamp out the small received signal prior to amplification or during the mixing process. Modeling noise coupling between on-chip digital and analog components provides a designer with valuable insights into the impact of a noisy environment on IC performance, early in the design phase. Furthermore, the effectiveness of design techniques to mitigate noise coupling can be simulated using these models. Modeling mixed-signal noise coupling requires modeling of the IC environment including the substrate, package and chip interconnects. This paper describes a simple analytical technique to determine a first-order model of the substrate. In conjunction with a simple package model, it provides useful information on the noise coupling paths in a design. Additionally, several techniques for modeling the switching noise generated by digital circuitry are reviewed in this paper. Also, the impact of this noise coupling on the performance of sensitive RF circuitry is modeled using periodic transfer functions. Application of these noise coupling models to real-life problems is illustrated with the help of a design example.

Keywords

Local Oscillator Solid State Circuit Local Oscillator Signal Switching Noise Clock Edge 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media Dordrecht 1999

Authors and Affiliations

  • Nishath K. Verghese
    • 1
  1. 1.Apres Technologies Inc.CupertinoUSA

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