Interfaces for Microsensor Systems

  • Carlos Azeredo Leme
  • Henry Baltes


We propose interface design strategies for CMOS sensor systems. The objective is to provide a microprocessor compatible sensor on a single chip. The interest of noise-shaping and oversampling techniques providing great flexibility and robustness are demonstrated. A new architecture for an oversampled noise-shaping A/D converter is also presented. It allows a significant simplification of the on-chip circuits, at the expense of high-speed signal processing at a remote data acquisition site.


Attenuation Expense Polyimide Candy 


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  1. [1]
    H. Baltes, T. Boltshauser, O. Brand, R. Lengenhager and D. Jaeggi “Silicon Microsensors and Microstructures”, in proc. IEEE International Symposium on Circuits and Systems, pp. 1820–1825, May 10–13, 1992, S. Diego, U.S.A..Google Scholar
  2. [2]
    R. Howe, “Surface Micromachining for microsensors and Microactuators”, Journal of Vac. Science Technology, vol. 6, no. 6, pp. 1809–1813, 1988.MathSciNetCrossRefGoogle Scholar
  3. [3]
    H. Guckel and D. Burns, “Fabrication Techniques for Integrated Sensor Microstructures”, in Proc. IEEE 19861nt. Electron Devices Meeting, pp. 176–179, 1986.Google Scholar
  4. [4]
    K. Takahashi and T. Matsuo, “Integration of Multi-Electrode and Interface Circuits by Planar and Three-Dimensional Fabrication Technology”, Sensors and Actuators, vol. 5, pp. 89–99, 1984.CrossRefGoogle Scholar
  5. [5]
    E. Dijkmans and P. Naus, “Sigma-Delta Versus Binary Weighted AD/DA Conversion, What is the Most Promising?”, Proc 15th European Solid-State Circuit Conference, pp. 35–63, Sept. 1989.Google Scholar
  6. [6]
    J. Candy and G. Tomes, “Oversampling Methods for A/D and D/A Conversion”, Oversampling Delta-Sigma Data Converters: Theory, Design and Simulation„ pp. 1–29 New York, 1991.Google Scholar
  7. [7]
    B. Boser and B. Woolcy, “The design of sigma-delta modulation analog-to-digital converters”, IEEE Journal of Solid-State Circuits, vol. 23, no. 6, pp. 1298–1308, 1988.CrossRefGoogle Scholar
  8. [8]
    C. Eichenberger and W. Guggenbuhl, “On Charge Injection in Analog MOS Switches and Dummy Switch Compensation Techniques”, IEEE Trans. Circuits and Systems, vol. 37, no. 2, pp. 256–264, 1990.MathSciNetCrossRefGoogle Scholar
  9. [9]
    J. Pimbley and G. Michon, “The Output Power Spectrum Produced by Correlated Double Sampling”, IEEE Trans. Circuits and Systems, vol. 38, no. 9, pp. 1086–1090, 1991.CrossRefGoogle Scholar
  10. [10]
    R. Castagnetti, H. Baltes and A. Nathan, “Noise Correlations and Operating Conditions of Dual-Collector Magnetotransistors”, Sensors and Actuators A25–27, pp. 363–367, 1990.Google Scholar
  11. [11]
    T. Boltshauser and H. Baltes, “Capacitive Humidity Sensors in SACMOS Technology With Moisture Absorbing Photosensitive Polyimide”, Sensors and Actuators A25–27, pp. 509–512, 1990.Google Scholar
  12. [12]
    D. Jaeggi, D. Moser and H. Baltes, “Thermoelectric AC Power Sensor by CMOS Technology”, IEEE Electron Device Letts., EDL-13, pp. 366–368, 1992.Google Scholar
  13. [13]
    D. Jaeggi, C. Azeredo Leme, P. O’Leary and H. Baltes, “Improved CMOS Power Sensor”, to be published in Proc. 7th International Conf. Solid-State Sensors and Actuators, Transducers’93, Yokohama, Japan, June 1993.Google Scholar

Copyright information

© Springer Science+Business Media Dordrecht 1994

Authors and Affiliations

  • Carlos Azeredo Leme
    • 1
  • Henry Baltes
    • 1
  1. 1.Physical Electronics LaboratoryETH-Hönggerberg, HPT-F16ZürichSwitzerland

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