Abstract
The objective of this research was to evaluate several structural adhesives at low temperatures.
This research was supported in whole or in part by the U.S. Air Force under Delivery Order No, (33–616)58–12 monitored by the Materials Laboratory, Directorate of Laboratories, Wright Air Development Center.
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References
Wright Air Development Center, Technical Report 59–152.
R. M. McClintock and M. J. Hiza, “Epoxy resins as cryogenic structural adhesives,” Modern Plastics (June, 1958).
F. W. Reinhart, et al., Adhesion and Adhesives, Fundamentals and Practice, John Wiley and Sons, Inc., New York (1954).
Adhesive Properties, -300 to+700°F (ASTIA Document No. AD151529).
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Frost, W.M. (1960). The Strength of Ten Structural Adhesives at Temperatures Down to -424°F. In: Timmerhaus, K.D. (eds) Advances in Cryogenic Engineering. Advances in Cryogenic Engineering, vol 5. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-0537-9_45
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DOI: https://doi.org/10.1007/978-1-4757-0537-9_45
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