Tensile Cryostat for the Temperature Range 4° to 300°K
Interest in tensile studies on solids at very low temperatures has increased in recent years for many reasons. Basic studies of this kind, in conjunction with other auxiliary methods of investigation, are extremely illuminating in the progress toward a complete theory of the flow and fracture of metals. At low temperatures, thermally activated processes can be controlled so that other, less energetic effects can be observed. Repeated, discontinuous yielding of metals, for example, has been reported at 4.2°K by Wessel , by Blewitt et al. , and by Hull and Rosenberg  in metals not previously suspected of having a yield point. Also, in order to study the full effect of irradiation on the mechanical properties of metals, tensile experiments must be carried out at low temperatures since some radiation effects anneal out at temperatures considerably below room temperature. Although work of this nature has not yet been reported in the literature. the low temperatures at which radiation damage anneals are well established (see, for example, Reference ).
KeywordsTensile Specimen Liquid Helium Thermal Performance Epoxy Resin Adhesive Liquid Hydrogen
Unable to display preview. Download preview PDF.
- 1.E.T. Wessel, Trans. Am. Soc. Met., Vol. 49, 149 (1957).Google Scholar
- 5.H. B. Huntington, in Solid State Physics, Vol. 7, F. Seitz and D. Turnbull (ed.), Academic Press, Inc., New York (1958).Google Scholar
- 6.E.T. Wessel, A.S.T.M. Bull. No. 211, 40 (1956).Google Scholar
- 7.H.M. Rosenberg, Progress in Cryogenics, Vol. I. K. Mendelssohn (ed.), Academic Press, Inc., New York (1959).Google Scholar
- 11.R.H. Kropschot, J.E. Schrodt, M.M. Fulk, and B.J. Hunter, Advances in Cryogenic Engineering, Vol. 5, K. D. Timmerhaus (ed.). Plenum Press, Inc., New York (1960).Google Scholar
- 12.S. T. Stoy, ibid.Google Scholar
- 15.R.M. McClintock and M.J. Hiza, Mod. Plastics, Vol. 35, No. 10. 172 (1958).Google Scholar
- 17.R.L. Powell, M.D. Bunch, and L. P. Caywood, Advances in Cryogenic Engineering, Vol. 6, K.D. Timmerhaus (ed.), Plenum Press, Inc., New York (1961).Google Scholar