Abstract
The structural and thermodynamic properties of 13-atom argon clusters adsorbed on a substrate are studied using Molecular Dynamics simulations. The cluster atoms interact among themselves via a Lennard Jones potential, whereas the cluster-substrate interaction is modeled by a continuous model for the adsorbent surface. Heating and cooling processes on the system show that the adsorbed clusters exhibit solid and liquid like phases as well as a coexistence region of both of them. The strength of the cluster-substrate interaction determines the mechanism of desorption in the region of high temperatures.
PACS Nos: 36.40.+d, 64.70.Dv, 68.40.+e, 68.45.-v.
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References
T.P. Martin, Phys. Rep. 95, 167 (1983);
T.P. Martin, Angew. Chem. 98, 197 (1986).
C.L. Briant and J.J. Burton, J. Chem. Phys. 63, 2045 (1975);
E. Blaisten-Barojas and H.C. Andersen, Surf. Sci. 156, 548 (1985);
J. Jellinek, T.L. Beck, and RS. Berry, J. Chem. Phys. 84, 2783 (1986).
J. Farges, M.F. de Feraudy, B. Raoult, and G. Torchet, J. Chem. Phys. 84, 3941 (1986).
L. Verlet, Phys. Rev. 159, 98 (1964).
E. Blaisten-Barojas, Kinam 6, 71 (1984).
I.L. Garzón, M. Avalos and E. Blaisten-Barojas, to be published.
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© 1987 Plenum Press, New York
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Garzón, I.L., Avalos, M., Blaisten-Barojas, E. (1987). Structure and Melting of Argon Clusters on a Substrate. In: Jena, P., Rao, B.K., Khanna, S.N. (eds) Physics and Chemistry of Small Clusters. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-0357-3_28
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DOI: https://doi.org/10.1007/978-1-4757-0357-3_28
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4757-0359-7
Online ISBN: 978-1-4757-0357-3
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