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Electrical Characterisation of Thin Insulating Langmuir Blodgett Films Incorporated in Metal-Insulator-Metal Structures

  • N. J. Geddes
  • W. G. Parker
  • J. R. Sambles
  • N. R. Couch

Abstract

Renewed interest in the use of LB films as the passivating layer in electronic devices has led to our study of M-I-M structures incorporating such multilayers. Our initial studies concentrated on the Ag/LB/Ag system, silver being chosen for the electrodes due to its oxide free surface after evaporation and ω-tricosenoic acid for the LB material due to its ease of deposition [1]. In these structures the LB film was found to be non-insulating giving junction resistances typically of the order of ohms (even with 40 layers of ω-tricosenoic acid) [2,3]. The conduction mechanism through these junctions was caused by damage incurred during the evaporation of the top silver electrodes. To obviate this problem a metal for the top electrode with a much lower evaporation temperature was reguired. Magnesium was chosen, since its evaporation temperature of 300°C coupled with its low mass number made it ideal for the purpose. The result from Ag/40 layers LB/Mg were very promising giving fully insulating junctions. The LB film thickness was then reduced progressively down to 10 layers of ω-tricosenoic acid (300 Å thick) with no loss in its integrity. Electrical characterisation of these junctions with Ag bottom electrodes, Mg top electrodes and LB film thickness from 10–2 layers of ω-tricosenoic acid has been undertaken.

Keywords

Thin Solid Film Conduction Mechanism Passivating Layer Electrical Characterisation LANGMUIR BLODGETT Film 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

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    G. Veale, I.R. Girling and I.R. Peterson: Thin Solid Films 127, 293 (1985)ADSCrossRefGoogle Scholar
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    N.R. Couch, C.M. Montgomery and R. Jones: Thin Solid Films 135, 173 (1986)ADSCrossRefGoogle Scholar
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    N.J. Geddes, J.R. Sambles, D.J. Jarvis and N.R. Couch: Proc. of 3rd MED Conf., Washington (1986)Google Scholar
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    R.H. Tredgold and C.S. Winter: J. Phys. D: Appl. Phys. 14, L185 (1981)sADSCrossRefGoogle Scholar

Copyright information

© Plenum Press, New York 1988

Authors and Affiliations

  • N. J. Geddes
    • 1
  • W. G. Parker
    • 1
  • J. R. Sambles
    • 1
  • N. R. Couch
    • 2
  1. 1.Thin Film and Interface Group, Department of PhysicsUniversity of ExeterExeterUK
  2. 2.Long Range Research GroupGEC Hirst ResearchWembley, LondonUK

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