Growth, Properties and Characterisation of Metal Multilayers
Two evaporation units have been constructed for preparation of metal multilayers using thermal and electron bombard sources. CuNi, CuV and CuFe multilayers have been produced with the explicit intention of correlating physical properties with structure as determined by Transmission Electron Microscopy (TEM). Low temperature resistivity and interdiffusion measurements have been performed upon a series of CuNi foils over the modulation wavelength range 1.6 nm to 10 nm. An anomalously high residual resistivity and interdiffusion coefficient were obtained for a modulation wavelength of 2.8 nm to 3.0 nm, the resistivity peak persisting after annealing of the foils for 100 hrs at 380°C even though the x-ray satellite reflections had vanished. TEM, however, indicated that interfacial defects were retained during this treatment. Annealing the foils at 480°C for three hours resulted in a loss of the anomalous resistivity peak, x-ray satellite reflections and interfacial structure.