Methods of Measurement of Ionic Surface Contamination

  • Jack Brous


Surfaces which are truly free of contamination are, in our everyday experience, exceedingly rare. Such surfaces can be created under very special, carefully controlled laboratory conditions which, however, do not represent the real world of materials fabrication, processing, and storage.


Specific Conductance Ionic Density Specific Resistance Atmospheric Carbon Dioxide Electronic Assembly 
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  1. 1.
    K. L. Mittal, Surface contamination: An overview, in: Surface Contamination: Genesis, Detection and Control (K. L. Mittal, ed.), Vol. 1, pp. 3–45, Plenum Press, New York (1979).Google Scholar
  2. 2.
    W. A. Yager and S. O. Morgan, Surface leakage of pyrex glass, J. Phys. Chem. 35, 2026–2042 (1931).CrossRefGoogle Scholar
  3. 3.
    R. F. Field, Formation of ionized water films on dielectric under conditions of high humidity, J. Appl. Phys. 17, 318–325 (1946).CrossRefGoogle Scholar
  4. 4.
    S. W. Chaikin and F. M. Church, Character of insulator surface leakage at high humidity, IRE Transactions of the Professional Group on Component Parts, Vol. CP-5, No. 4, 153–156 (1958).Google Scholar
  5. 5.
    S. W. Chaikin, C. W. McClelland, J. Janney, and S. Landsman, Contamination and electrical leakage in printed wiring, Ind. Eng. Chem. 51, 305–308, (1959).CrossRefGoogle Scholar
  6. 6.
    W. B. Wargotz, Quantification of contaminant effects upon electrical behavior of printed wiring, IPC Tech. Rev., 9–15 (January, 1978). Also Circuits Manufacturing18(2), 42–49 (1978).Google Scholar
  7. 7.
    T. F. Egan, Determination of plating salt residues, Plating50(4), 350–354 (1973).Google Scholar
  8. 8.
    N. E. Dorsey, Properties of Ordinary Water Substance, pp. 374–375, 380, Reinhold Publishing Corp., New York (1940).Google Scholar
  9. 9.
    F. N. Alquist, Preparation and maintenance of high purity water, in: Symposium on High Purity Water Corrosion, 58th Annual Meeting of the American Society for Testing and Materials (June 28, 1955), Publication No. 179, ASTM, Philadelphia, Pa.Google Scholar
  10. 10.
    D. Eisenberg and W. Kauzmann, The Structure and Properties of Water, Oxford University Press, New York and Oxford (1969).Google Scholar
  11. 11.
    H. S. Harned and B. B. Owen, The Physical Chemistry of Electrolytic Solutions, 3rd Ed., ACS Monograph No. 137, Reinhold Publishing Corp., New York (1958).Google Scholar
  12. 12.
    F. Daniels and R. A. Alberty, Physical Chemistry, 2nd Ed., John Wiley and Sons, New York, London (1961).Google Scholar
  13. 13.
    J. O’M. Bockris and A. K. N. Reddy, Modern Electrochemistry, Plenum Press, New York (1970).Google Scholar
  14. 14.
    W. T. Hobson and R. J. DeNoon, Printed Wiring Assemblies, Detection of Ionic Contaminants On, Materials Research Report 3–72 (1972), Naval Avionics Center, Indianapolis, Ind.Google Scholar
  15. 15.
    W. T. Hobson and R. J. DeNoon, Review of Data Generated with Instruments Used to Detect and Measure Ionic Contaminants on Printed Wiring Assemblies, Materials Research Report 3–78 (1978), Naval Avionics Center, Indianapolis, Ind.Google Scholar
  16. 16.
    W. T. Hobson, Testing for ionic contaminants, Contamination Control 3(1), 9 (March, 1981).Google Scholar
  17. 17.
    MIL-P-28809, Military Specification, Printed Wiring Assemblies.Google Scholar
  18. 18.
    E. W. Wolfgram, Means and Method for Measuring Levels of Ionic Contamination, U.S. Patent 4,023,931 (May 17, 1977).Google Scholar
  19. 19.
    I/C Staff, Measure ionic contamination level on the production line, Insulation/Circuits, 27(13) (1975).Google Scholar
  20. 20.
    Omega Meter II, Bulletin No. 379, Kenco Industries, Inc., Atlanta, Ga.Google Scholar
  21. 21.
    W. Kenyon, Fundamentals of Ionic Contamination Measurement Using Solvent Extract Methods, IPC-TP-177, The Institute for Interconnecting and Packaging Electronic Circuits, Evans-ton, Ill. (September, 1977).Google Scholar
  22. 22.
    B. N. Ellis, Handbook of Contamination, Protonique, S.A., Romanel, Switzerland (English ed., 1981).Google Scholar
  23. 23.
    J. Brous, Evaluation of post-solder flux removal, Welding Journal, Research Supplement, 444s–448s (December, 1975).Google Scholar
  24. 24.
    J. Brous, Self-Purging Apparatus for Determining the Quantitative Presence of Derived Ions, U.S. Patent 3,973,572 (Aug. 10, 1976).Google Scholar
  25. 25.
    J. Brous, Extraction methods for measurement of ionic surface contamination, in: Surface Contamination: Genesis, Detection and Control (K. L. Mittal, ed.), pp. 843–855, Plenum Press, New York (1979).Google Scholar
  26. 26.
    R. Woodgate, Use of resistivity meters in pc cleaning systems, Electronic Production 10(2), 26 (1981).Google Scholar
  27. 27.
    P. R. Taylor, P. L. Altavilla, and G. J. Simonds, Solvent Extract Resistivity—Is It Meaningful?, IPC Technical Report #TR-41, IPC, Evanston, Ill.Google Scholar
  28. 28.
    H. E. Phillips, Ionic residue removal: Which solvent is best, Elect. Packag. Prod. 13(9), 177–180 (1973).Google Scholar
  29. 29.
    W. G. Kenyon, How to use the solvent extract method to measure ionic contamination of printed wiring assemblies, Insulation/Circuits27(3), 47–49 (1981).Google Scholar
  30. 30.
    P. Altavilla, Analysis of chloride contaminants on pcb’s reveals causes, suggests preventative action, Insulation/Circuits20(10), 46–48 (1974).Google Scholar
  31. 31.
    D. F. Ball, Equipment parameters for aqueous flux removal after IR reflow, Insulation/Circuits26(11), 55–60(1980).Google Scholar
  32. 32.
    J. W. Dennison, Jr., Cleaning of printed circuits boards to remove ionic soils, Materials Performance 14(3), 36–40 (1975).Google Scholar
  33. 33.
    D. Howell, Make pc boards come clean, Electronic Products Magazine, 27–34 (June 1976).Google Scholar
  34. 34.
    T. O. Duyck, Testing large printed circuit boards for cleanliness, Insulation/Circuits24(11), 38–41 (1978).Google Scholar
  35. 35.
    C. J. Tautscher, New generation of board and assembly cleanliness tests, Insulation/Circuits, 25(13), 15–19 (1979).Google Scholar
  36. 36.
    W. B. Wargotz, Ion Chromatography Quantification of Contaminant Ions in Water Extracts of Printed Wiring, IPC Technical Paper #TP-248, IPC, Evanston, Ill. (1978).Google Scholar
  37. 37.
    C. W. Jennings, Filament formation on printed wiring boards, in: How to Avoid Metallic Growth Problems (IPC Blue Ribbon Committee Report), IPC-TR-476, Institute of Printed Circuits, Evanston, Ill. (September, 1976) pp. 25–32.Google Scholar
  38. 38.
    W. G. Kenyon, The Evaluation of Commercial Flux/Solder Deflux Systems, Part I: The Effect of Incoming Printed Wiring Board Contamination on Post-Assembly Test Results, DuPont Technical Report RP-11, E. I. DuPont de Nemours & Co., Wilmington, Del., pp. 14–15 (1982).Google Scholar

Copyright information

© Plenum Press, New York 1987

Authors and Affiliations

  • Jack Brous
    • 1
  1. 1.Alpha Metals, Inc.NewarkUSA

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