Properties of Solids
A knowledge of the properties and behavior of materials used in any cryogenic system is essential for proper design considerations. Often the choice of materials for the construction of cryogenic equipment will be dictated by consideration of mechanical and physical properties such as thermal conductivity (heat transfer along a structural member), thermal expansivity (expansion and contraction during cycling between ambient and low temperatures), and density (mass of system). Since properties at low temperatures are often significantly different from those at ambient temperature, there is no substitute for test data. To help summarize the data that do exist and help estimate properties when no data are available, it is useful to have certain general rules in mind. That is the purpose of the following discussion.
KeywordsThermal Conductivity Fatigue Strength Critical Field Superconducting State Flux Line
Unable to display preview. Download preview PDF.
- 1..H. G. Van Bueren, Imperfections in Crystals, Interscience Publishers, New York, 1960.Google Scholar
- 2.C. S. Barrett, Trans. Am. Soc. Metals 49, 53 (1957).Google Scholar
- 3.T. F. Durham, R. M. McClintock, and R. P. Reed, Cryogenic Materials Data Handbook, NBS Pub. 171809, Office of Technical Services, U.S. Dept. of Commerce, Washington, DC, 1962.Google Scholar
- 4.J. E. Campbell, Handbook on Materials for Superconducting Machinery (MCIC-HB-04), Metals and Ceramics Information Center, Battelle Memorial Institute, Columbus, OH, 1974.Google Scholar
- 5.H. P. Gibbons and R. M. McClintock, Mechanical Properties of Structural Materials at Low Temperatures, NBS Monograph 13, U.S. Government Printing Office, Washington, DC, 1960.Google Scholar
- 6.R. J. Corruccini and J. J. Gniewek, Specific Heats and Enthalpies of Technical Solids at Low Temperatures, NBS Monograph 21, U.S. Government Printing Office, Washington, DC, 1960.Google Scholar
- 7.V. J. Johnson (Ed.), A Compendium of the Properties of Materials at Low Temperatures (Phase I), Part II, Properties of Solids, WADD Technical Report 60–56, 1960.Google Scholar
- 9.Y. S. Touloukian (Ed.), Thermophysical Properties Research Center Data Book, Vol. 1, Metallic Elements and Their Alloys, Purdue University, W. Lafayette, Indiana, 1964, Chap. 1.Google Scholar
- 10.R. W. Powell, C. Y. Ho, and P. E. Liley, Thermal Conductivity of Selected Materials (NSRDS-NBS 8), U.S. Government Printing Office, Washington, DC, 1966.Google Scholar
- 11.R. J. Corruccini and J. J. Gniewek, Thermal Expansion of Technical Solids at Low Temperatures, NBS Monograph 29, U.S. Government Printing Office, Washington, DC, 1961.Google Scholar
- 12.G. K. White, Experimental Techniques in Low Temperature Physics, Clarendon Press, Oxford, England, 1959.Google Scholar
- 13.M. M. Fulk, Progress in Cryogenics, Vol. 1, K. Mendelssohn (Ed.), Heywood, London, 1959, p. 65.Google Scholar