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Microstructural Analysis of Rapidly Solidified Alumina

  • John P. Pollinger
  • Gary L. Messing
Part of the Materials Science Research book series (MSR, volume 17)

Abstract

Rapid solidification processing (RSP) of metals and semiconductors has become an established field over the last 10 years. The major emphasis of RSP has been the development of new and unique materials as a result of the fast cooling rates (> 104 °c/ sec) of the molten materials. Generally, it has been shown that improved homogeneity, structural refinement, finer grain size, and non-equilibrium phases can be obtained for a wide variety of materials. These findings have been coupled with significant improvements in physical, electrical, and chemical properties of the metallic and semiconductor materials.

Keywords

Cool Rate Power Density Thermal Shock Fast Cool Rate Scanning Direction 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Plenum Press, New York 1984

Authors and Affiliations

  • John P. Pollinger
    • 1
  • Gary L. Messing
    • 1
  1. 1.Department of Materials Science and EngineeringThe Pennsylvania State UniversityUniversity ParkUSA

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