Microstructural Analysis of Rapidly Solidified Alumina
Rapid solidification processing (RSP) of metals and semiconductors has become an established field over the last 10 years. The major emphasis of RSP has been the development of new and unique materials as a result of the fast cooling rates (> 104 °c/ sec) of the molten materials. Generally, it has been shown that improved homogeneity, structural refinement, finer grain size, and non-equilibrium phases can be obtained for a wide variety of materials. These findings have been coupled with significant improvements in physical, electrical, and chemical properties of the metallic and semiconductor materials.
KeywordsCool Rate Power Density Thermal Shock Fast Cool Rate Scanning Direction
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