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Heat Transfer between Fine Copper Powders and Dilute 3He in Superfluid 4He

  • R. Radebaugh
  • J. D. Siegwarth

Abstract

The use of high-surface-area materials in dilution refrigerators has prompted several studies of the thermal resistance between such materials and dilute or concentrated 3He in 4He. Roubeau et al. t first reported anomalously high values for the Kapitza resistance of 20-μm-thick copper foil as compared with the Kapitza resistance of bulk copper. They proposed that this was a result of a thermal resistance between phonons and electrons. Wheatley et al.2 also saw this higher resistance when using 32-μm copper foil. We looked for this effect in sintered copper powders of 27, 20, and 2 μm diameter and also found high resistances.3 Our results were in semiquantitative agreement with Seiden’s calculations’ on the phonon-electron resistance.

Keywords

Thermal Resistance Copper Foil Copper Powder Bulk Copper Thermal Boundary Resistance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    P. Roubeau, D. LeFur, and E.J.A. Varoquaux, in Proc. 3rd Intern. Cryogenic Engineering Conf. West Berlin, 1970,p. 315.Google Scholar
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Copyright information

© Springer Science+Business Media New York 1974

Authors and Affiliations

  • R. Radebaugh
    • 1
  • J. D. Siegwarth
    • 1
  1. 1.Cryogenics DivisionNBS Institute for Basic StandardsBoulderUSA

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