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Thermal Accommodation Coefficients of Helium and Nitrogen on Copper Surfaces

  • M. E. Cochran
  • R. K. Irey
Part of the Advances in Cryogenic Engineering book series (ACRE, volume 17)

Abstract

Free molecule flow heat transfer occurs when the predominant mechanism of molecular transport is by direct molecule-wall collisions rather than through a sequence of molecule-molecule collisions. It is generally accepted that a Knudsen number of three or more is sufficient to achieve this condition.

Keywords

Heat Transfer Rate Knudsen Number Copper Surface Total Heat Transfer Total Heat Flux 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    M. E. Cochran, M.S. Thesis, University of Florida, Gainesville, Florida (1970).Google Scholar

Copyright information

© Springer Science+Business Media New York 1972

Authors and Affiliations

  • M. E. Cochran
    • 1
  • R. K. Irey
    • 1
  1. 1.University of FloridaGainesvilleUSA

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