Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage

  • C.-P. Yeh
  • C. Ume
  • R. E. Fulton
  • K. W. Wyatt
  • J. W. Stafford


Thermomechanical design effects in the printed wiring board (PWB) design process are becoming increasingly important due to ever more stringent electronic product requirements. In the past few years, the finite element method (FEM) has become a vital and effective tool to support many facets of the PWB design process. Despite its increasing popularity in PWB design, the FEM has seldom been validated for its appropriateness and accuracy in modeling PWB thermomechanical behavior. We have conducted a research project in developing advanced FEM-oriented capabilities to simulate thermally induced PWB warpage. The FE analysis results are validated by correlating them with measurements obtained from a separate experimental approach using the shadow moiré method.


Finite Element Analysis Copper Foil Fringe Order Print Wiring Board Specimen Configuration 
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Copyright information

© Van Nostrand Reinhold 1993

Authors and Affiliations

  • C.-P. Yeh
  • C. Ume
  • R. E. Fulton
  • K. W. Wyatt
  • J. W. Stafford

There are no affiliations available

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