Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry

  • Arkady Voloshin


In the area of thermal stress analysis, there has been a persisting need for reliable tools to better understand and characterize material behavior, reveal structural response to thermal loads, and determine distributions of stresses and strains in different geometries under various boundary conditions. Different approaches — analytical, numerical, or experimental—have been applied to handle these problems.


Fringe Pattern Digital Image Analysis Diffraction Order Fringe Order Conformal Coating 
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© Van Nostrand Reinhold 1993

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  • Arkady Voloshin

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