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Corrosion in Microelectronics Packages

  • X. Shan
  • M. Pecht

Abstract

The potential for failure in a microelectronic device due to corrosion has increased as the device metallization tracks have become narrower and thinner, the separation between metallization tracks has become closer, and bond pads have become smaller. Although corrosion problems are well documented in the literature and preventive measures are known, corrosion failures continue to occur. About 20% of electronic failures are caused by corrosion.1,2 Most of the problems result from a violation of one or more of the fundamental design or corrosion-prevention guidelines, caused by improper material selection, improper design of geometry, or inadequate control of the manufacturing and assembly processes.

Keywords

Corrosion Rate Stress Corrosion Corrosion Current Density Corrosion Fatigue Crevice Corrosion 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Van Nostrand Reinhold 1993

Authors and Affiliations

  • X. Shan
  • M. Pecht

There are no affiliations available

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