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Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate

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Thermal Stress and Strain in Microelectronics Packaging

Abstract

The pin grid array (PGA) is one form of first-level package.1–4 It has had a predominant role in high-density packaging for many years and is commonly used in high-performance computers. The advantages of the PGA are: (1) excellent electrical performance (controlled impedance); (2) the I/O pins are spread over the area of substrate, making it possible to have a very large number of I/Os; and (3) the I/O pins are placed in a very small area, making it possible to have a small package with short circuit lines.

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Authors
  1. John Lau
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  2. Ravi Subrahmanyan
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  3. Steve Erasmus
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  4. Sherman Leung
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  5. Che-Yu Li
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Editors and Affiliations

  1. Hewlett-Packard Company, Palo Alto, California, USA

    John H. Lau PhD, PE

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© 1993 Van Nostrand Reinhold

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Lau, J., Subrahmanyan, R., Erasmus, S., Leung, S., Li, CY. (1993). Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate. In: Lau, J.H. (eds) Thermal Stress and Strain in Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7767-2_21

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  • DOI: https://doi.org/10.1007/978-1-4684-7767-2_21

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