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Nonlinear Analysis of a Ceramic Pin Grid Array (PGA) Soldered to an Orthotropic Epoxy Substrate

  • John Lau
  • Ravi Subrahmanyan
  • Steve Erasmus
  • Sherman Leung
  • Che-Yu Li

Abstract

The pin grid array (PGA) is one form of first-level package.1–4 It has had a predominant role in high-density packaging for many years and is commonly used in high-performance computers. The advantages of the PGA are: (1) excellent electrical performance (controlled impedance); (2) the I/O pins are spread over the area of substrate, making it possible to have a very large number of I/Os; and (3) the I/O pins are placed in a very small area, making it possible to have a small package with short circuit lines.

Keywords

Fatigue Life Solder Joint Print Circuit Board Electronic Packaging Displacement Boundary Condition 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Van Nostrand Reinhold 1993

Authors and Affiliations

  • John Lau
  • Ravi Subrahmanyan
  • Steve Erasmus
  • Sherman Leung
  • Che-Yu Li

There are no affiliations available

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