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Solder Joint Reliability of Leadless Chip Carriers

  • Jim Lynch
  • Alberto Boetti

Abstract

Ever since the introduction of the integrated circuit in the late 1950s there has been a continuous growth in the levels of complexity and density of functions in electronic systems. This has progressed in parallel with the density of function within such devices and with the degree of interconnection to other system levels. The two prime technology bases enabling inter­connection between devices are the printed wiring (or printed circuit) board and the thick-film hybrid. The historical difference between printed wiring boards and hybrid technology was the method used to attach the integrated circuit and the method of protecting it from mechanical and environmental damage.

Keywords

Solder Joint Temperature Cycling Ceramic Substrate Thermal Mismatch Print Wiring Board 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Van Nostrand Reinhold 1993

Authors and Affiliations

  • Jim Lynch
  • Alberto Boetti

There are no affiliations available

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