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Thermomechanical Fatigue of 63Sn-37Pb Solder Joints

  • Peter L. Hacke
  • Arnold F. Sprecher
  • Hans Conrad

Abstract

Thermal fluctuation experienced by an electronics package during normal operation causes strains, and in turn stresses, in the solder joints. These result from differences in coefficient of thermal expansion between the various components of the package; see, for example, Figure 15-1. The thermal fluctuation can be produced by heat dissipated in the electronic components or by environmental temperature changes. The repetition of such fluctuations produces cyclic strains and stresses, which ultimately lead to the failure of the solder joints in fatigue.

Keywords

Solder Joint Monotonic Loading THERMOMECHANICAL Fatigue Plastic Shear Strain Isothermal Fatigue 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Subrahmanyan, R., J. R. Wilcox, and C.-Y. Li, “A Damage Integral Approach to Thermal Fatigue of Solder Joints,” IEEE Trans. Components,Hybrids, and Manufacturing Technology, 12(4), 1989, pp. 480–491.Google Scholar
  2. 2.
    Li, C.-Y., R. Subrahmanyan, J. R. Wilcox, and D. Stone, “A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints,” Solder Joint Reliability, J. H. Lau, ed., Van Nostrand Reinhold, New York, 1991, pp. 361–383.CrossRefGoogle Scholar
  3. 3.
    Shine, M. C., and L. R. Fox, “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue, ASTM Special Technical Publication 942, 1987, pp. 588–610.Google Scholar
  4. 4.
    Knecht, S., and L. Fox, “Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction,” ref. 2, pp. 508–544.Google Scholar
  5. 5.
    Hall, P. M., “Creep and Stress Relaxation in Solder Joints,” ref. 2, pp. 306–332.Google Scholar
  6. 6.
    Solomon, H. D., “Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data,” ref. 2, pp. 406–454.Google Scholar
  7. 7.
    Engelmaier, W., “Solder Attachment Reliability, Accelerated Testing and Result Evaluation,” ref. 2, pp. 545–587.Google Scholar
  8. 8.
    Clech, J. P., and J. A. Augis, “Surface Mount Attachment Reliability and Figures of Merit for Design for Reliability,” ref. 2, pp. 588–613.Google Scholar
  9. 9.
    Arrowood, R., A. Mukherjee, and W. R. Jones, “Hot Deformation of Two-Phase Mixtures,” Solder Mechanics, D. R. Frear, W. D. Jones, and K. R. Kinsman, TMS, Warrendale, PA, 1991, pp. 107–153.Google Scholar
  10. 10.
    Bird, J. E., A. K. Mukherjee, and J. E. Dorn, “Correlations Between High-Temperature Creep Behavior and Structure,” Quantitative Relation Between Properties and Microstructure, A. Rosen, ed., Israel University Press, Jerusalem, 1969, pp. 255–342.Google Scholar
  11. 11.
    Morris, Jr., J. W., D. Tribula, T. S. E. Summers, and D. Grivas, “The Role of Microstructure on Thermal Fatigue of Pb—Sn Solder Joints,” ref. 2, pp. 225–265.Google Scholar
  12. 12.
    Mei, Z., and J. W. Morris, Jr., “Fatigue Lives of 60Sn-40Pb Solder Joints Made With Different Cooling Rates,” Journal of Electronic Packaging, 114(2), 1992, pp. 104–108.CrossRefGoogle Scholar
  13. 13.
    Mei, Z., D. Grivas, M. C. Shine, and J. W. Morris, Jr., “Superplastic Creep of Eutectic Tin—Lead Solder Joints,” Journal of Electronic Materials, 19(11), 1990, pp. 1273–1280.CrossRefGoogle Scholar
  14. 14.
    Vastava, R. B., and T. G. Langdon, “An Investigation of Intercrystalline and Interphase Boundary Sliding in the Superplastic Pb-62% Sn Eutectic,” Acta Metallurgica, 27, 1979, pp. 251–257.CrossRefGoogle Scholar
  15. 15.
    Grivas, D., K. L. Murty, and J. W. Morris, Jr., “Deformation of Pb—Sn Eutectic Alloys at Relatively High Strain Rates,” Acta Metallurgica, 27, 1979, pp. 731–737.CrossRefGoogle Scholar
  16. 16.
    Guo, Z., A. F. Sprecher, and H. Conrad, “Plastic Deformation Kinetics of Eutectic Pb—Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue,” ASME Symp. Mechanics of Surface Mount Assemblies, Atlanta, GA, December 1991. Journal of Electronic Packaging, 114(2), 1992, pp. 112–117.Google Scholar
  17. 17.
    Solomon, H. D., “Low Cycle Fatigue of 60/40 Solder-Plastic Strain Limited vs. Displacement Limited Testing,” ASM 2d Electronic Packaging Materials and Processes Conference, Bloomington, MN, 29–31 October 1985, ASM, Metals Park, OH, pp. 29–47.Google Scholar
  18. 18.
    Bae, K., A. F. Sprecher, D. Y. Jung, and H. Conrad, “Fatigue of 63Sn-37Pb Solder Used in Electronic Packaging,” International Symp. Testing and Failure Analysis, ISTFA 1988, ASM, Metals Park, OH, 1988, pp. 53–61.Google Scholar
  19. 19.
    Hall, P. M., “Forces, Moments and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards,” IEEE Trans. Components, Hybrids,and Manufacturing Technology, CHMT-7(4), 1984, pp. 314–327.Google Scholar
  20. 20.
    Liljestrand, L.-G., and L.-O. Andersson, “Accelerated Thermal Fatigue Cycling of Surface Mounted PWB Assemblies in Telecom Equipment,” Proc. Seventh Annual Electronics Packaging Conference, Boston, MA, 1987, pp. 411–424.Google Scholar
  21. 21.
    Clech, J.-P., and J. A. Augis, “Engineering Analysis of Thermal Cycling Accelerated Tests for Surface-Mount Attachment Reliability Evaluation,” Proc. 7th Annual International Electronics Packaging Conference, Boston, MA, 1987, pp. 385–424.Google Scholar
  22. 22.
    Langdon, T. G., “The Significance of Grain Boundary Sliding in Creep and Superplasticity,” Metals Forum, 4, 1981, pp. 14–23.Google Scholar
  23. 23.
    Kashyap, B. P., and G. S. Murty, “Experimental Constitutive Relations for High Temperature Deformation of a Pb/Sn Eutectic Alloy,” Materials Science and Engineering, 50, 1981, pp. 205–213.CrossRefGoogle Scholar
  24. 24.
    Frear, D., Grivas, D., and Morris, Jr., J. W., “Parameters Affecting Thermal Fatigue Behavior of 60Sn-40Pb Solder Joints,” Journal of Electronic Materials, 18(6), 1989, pp. 671–680.CrossRefGoogle Scholar
  25. 25.
    Conversation with P. Hall, 1990.Google Scholar
  26. 26.
    Stone, D., S.-P. Hannula, and C.-Y. Li, “The Effects of Service and Material Variables on the Fatigue Behavior of Solder Joints during the Thermal Cycle,” Proc. 35th Electronic Components Conference, IEEE, 1985, pp. 46–51.Google Scholar
  27. 27.
    Wilcox, J. R., R. Subrahmanyan, and Che-Yu Li, “Thermal Stress Cycles and Inelastic Deformation in Solder Joints,” Proc. 2d ASM International Electronic Materials and Processing Congress, Philadelphia, PA, 1989, pp. 203–211.Google Scholar
  28. 28.
    Guo, Z., A. F. Sprecher, and H. Conrad, “Crack Initiation and Growth During Low-Cycle Fatigue of Pb—Sn Solder Joints,” 41st Electronic Components and Technology Conference, 41st ECTC, IEEE CHMT, IEEE Catalogue No. 91CH2989–2, 1991, pp. 658–666.Google Scholar
  29. 29.
    Hacke, P. L., A. F. Sprecher, and H. Conrad, “Modeling of the ThermoMechanical Fatigue of 63Sn-37Pb Alloy,” ASTM Symposium Thermomechanical Fatigue Behavior of Materials, San Diego, CA, 1991, ASTM STP 1186, 1993.Google Scholar
  30. 30.
    Solomon, H. D., “Fatigue of 60/40 Solder,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, CHMT-9(4), 1986, pp. 423–432.Google Scholar
  31. 31.
    Paris, P. C., and F. Erdogan, “A Critical Analysis of Crack Propagation Laws,” Trans. ASME,Journal of Basic Engineering, 85, 1963, pp. 528–534.CrossRefGoogle Scholar
  32. 32.
    Dieter, G. E., Mechanical Metallurgy, 3d edn, McGraw-Hill, New York, 1986, pp. 398 –401.Google Scholar

Copyright information

© Van Nostrand Reinhold 1993

Authors and Affiliations

  • Peter L. Hacke
  • Arnold F. Sprecher
  • Hans Conrad

There are no affiliations available

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