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Solutions to Moisture Resistance Degradation During Solder Reflow of Plastic Surface Mount Components

  • Suresh V. Golwalkar

Abstract

Plastic packages are exposed to extreme temperatures in a surface mount process environment of infrared reflow, vapor phase reflow, hot air reflow, or when the packages are immersed in molten solder during wave soldering. When the internal temperature of the package exceeds 210°C, the risk of encountering different structural weaknesses such as package cracking, delamination, or bond cratering is increased1. The electrical functionality of the package is not threatened immediately on the onset of these physical weaknesses. However, the potential impact of such physical weaknesses on the long-term reliability is a matter of concern.

Keywords

Moisture Absorption Peel Strength Molding Compound Lead Frame Reflow Process 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Impact of Moisture on Plastic I/C Package Cracking, IPC-SM-786, 1990, pp. 1-29.Google Scholar
  2. 2.
    Lin, R., E. Blackshear, and P. Serisky, Proc. IEEE International Reliability Physics Symposium, 1988, pp. 83 - 89.Google Scholar
  3. 3.
    Steiner, T., and D. Duhl, IEEE Trans. Components, Hybrids, and Manufacturing Technology, 10, 1987, pp. 209 - 216.CrossRefGoogle Scholar
  4. 4.
    Golwalkar, S., P. Boysan, and R. Foehringer, Proc. IEEE Electronic Components and Technology Conference, 1991, pp. 745 - 749.Google Scholar
  5. 5.
    Moore, T., R. McKenna, and S. J. Kelsall, Proc. IEEE International Reliability Physics Symposium, 1991, pp. 160 - 166.Google Scholar
  6. 6.
    Koch, T., W. Richling, J. Whitlock, and D. Hall, Proc. IEEE International Reliability Physics Symposium, 1986, pp. 55 - 60.Google Scholar
  7. 7.
    Koyama, H., H. Shiozaki, I. Okumura, S. Mizugashira, H. Higuchi, and T. Ajiki, Proc. IEEE International Reliability Physics Symposium, 1988, pp. 59 - 63.Google Scholar
  8. 8.
    Moore, T., Proc. 16th International Symposium for Testing and Failure Analysis, 1990, pp. 61 - 67.Google Scholar
  9. 9.
    Glaser, J. C., and M. P. Juaire, American Society of Mechanical Engineers, 88-WA/EEP-4, November 1988.Google Scholar
  10. 10.
    Miyake, K., H. Suzuki, and S. Yamamoto, IEEE Trans. Reliability, R-34(5), December 1985, pp. 402 - 409.Google Scholar
  11. 11.
    Bhattacharya, B. K., W. A. Huffman, W. E. Jahsman, and B. Natarajan, Proc. IEEE Electronic Components and Technology Conference, 1988, pp. 49 - 58.Google Scholar
  12. 12.
    Kim, S. Proc. IEEE Electronic Components and Technology Conference, 1991, pp. 750 - 758.Google Scholar
  13. 13.
    Kitagawa, H. et al., Proc. IEEE Electronic Components and Technology Conference, 1989, pp. 445 - 449.Google Scholar
  14. 14.
    Kitano, M., A. Nishimura, and S. Kawai, Proc. IEEE International Reliability Physics Symposium, 1988, pp. 90 - 95.Google Scholar
  15. 15.
    Kornblum, Y., and J. C. Glaser, J. Electronic Packaging, Trans. ASME, 111, December 1989, pp. 249 - 254.Google Scholar
  16. 16.
    Suhl, D., M. Kirloskar, and T. O. Steiner, IEEE Trans. Components, Hybrids, and Manufacturing Technology, 11, 1988, pp. 129 - 132.Google Scholar
  17. 17.
    Nishioka, T., S. Oizumi, and S. Ito, Nitto Technical Reports, January 1991, pp. 82 - 93.Google Scholar
  18. 18.
    Suzuki, H., Sumitomo Reports, 1990, pp. 287 - 312.Google Scholar
  19. 19.
    Nikkei Microdevices, 9, 1988, pp. 115-120.Google Scholar
  20. 20.
    Altimari, S., S. Golwalkar, P., Boysan, and R. Foehringer, Proc. IEEE Electronic Components and Technology Conference, 1992, pp. 945 - 950.Google Scholar
  21. 21.
    The Reliability of TSOP and TQFP,“ Semiconductor World, June 1991, pp. 108-112.Google Scholar
  22. 22.
    Prough, S., and D. E. Pope, Materials Research Society Symposium Proc., 167, 1990, pp. 5 - 21.Google Scholar
  23. 23.
    McMaster, M. G., and D. S. Soane, IEEE Trans. Components, Hybrids, and Manufacturing Technology, 12, 1989, pp. 373 - 386.CrossRefGoogle Scholar
  24. 24.
    Kong, E. S. W., Epoxy Resins and Composites, II, K. Dusek, ed., Springer, New York, 1986, pp. 125 - 172.Google Scholar
  25. 25.
    Kamon, T., and H. Furukawa, Epoxy Resins and Composites, II, K. Dusek, ed., Springer, New York, 1986, p. 179.Google Scholar
  26. 26.
    Nakamura, Y. et al., Nitto Technical Reports, September 1987, pp. 23 - 31.Google Scholar
  27. 27.
    Drzal, L. T., Epoxy Resins and Composites, II, K. Dusek, ed., Springer, New York, 1986, pp. 1 - 32.Google Scholar
  28. 28.
    Porto, A. et al., Materials Research Society Symposium Proc., 108, 1988, pp. 169 - 174.Google Scholar
  29. 29.
    Apicella, A., and L. Nicolais, Epoxy Resins and Composites, II, K. Dusek, ed., Springer, New York, 1985, pp. 69 - 78.Google Scholar
  30. 30.
    Yorkgitis, E. M. et al., Epoxy Resins and Composites, II, K. Dusek, ed., Springer, New York, 1982, p. 97.Google Scholar

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© Van Nostrand Reinhold 1993

Authors and Affiliations

  • Suresh V. Golwalkar

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