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Thermal and Moisture Stresses in Plastic Packages

  • Michel Mermet-Guyennet

Abstract

Increased package density and reliability expectations require a better understanding of the mechanical behavior of plastic packages under process and use conditions. This chapter reviews potential failure modes and a combined analytical/experimental approach developed under ESPRIT project 5033—PLASIC for stress analysis in plastic packages. This includes (1) a failure criterion for moisture-induced stresses; (2) a finite-element approach for thermal stress analysis; and (3) a piezoresistive technique for stress measurements and model calibration. The latter is applied to the particular problem of metal line displacement at the surface of a silicon die.

Keywords

Thermal Shock Moisture Stress Metal Line Molding Compound Lead Frame 
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Copyright information

© Van Nostrand Reinhold 1993

Authors and Affiliations

  • Michel Mermet-Guyennet

There are no affiliations available

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