Abstract
Plastic packages play a major role in the further growth of the microelectronic industry.1 This is due to the low cost and the reliability of plastic packages, as well as to the excellent compatibility of plastic package designs with mass production techniques.2 There are, however, several serious concerns in the rapid evolution of plastic packaging technology, and one of the most critical of them is elevated residual bow of plastic packages.
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© 1993 Van Nostrand Reinhold
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Suhir, E. (1993). Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices. In: Lau, J.H. (eds) Thermal Stress and Strain in Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7767-2_12
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DOI: https://doi.org/10.1007/978-1-4684-7767-2_12
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4684-7769-6
Online ISBN: 978-1-4684-7767-2
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