Handbook of Analytical Design for Wear

  • R. G. Bayer
  • T. C. Ku


The purpose of this work is to present to design engineers analytical design procedures for wear. For this purpose, the work has been divided into three main sections. The first section contains a short summary of the models used as a basis for the design procedures. The second section contains the design procedures and examples of their use. The third section contains a selection of tables and figures which are germane to the design procedures. This section contains a short summary of expressions for stress, values of Young’s modulus and Poisson’s ratio for the more common materials, and other tables, in addition to the main table of zero wear factors for a large number of combinations of materials and lubricants.


Normal Load Unit Operation Anodize Aluminum Layered Material Maximum Shear Stress 
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    R.G. Bayer, W.C. Clinton, C.W. Nelson and R.A. Schumacher, “Engineering Model for Wear”, Wear, 5, (1962), pp. 378–391.CrossRefGoogle Scholar
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    R.G. Bayer, W.C. Clinton and J.L. Sirico, “A Note on the Application of the Stress Dependency of Wear in the Wear Analysis of an Electrical Contact”, Wear, 7, (1964) pp. 280–287.CrossRefGoogle Scholar
  3. 3.
    W.C. Clinton, T.C. Ku and R.A. Schumacher, “Extension of the Engineering Model for Wear to Plastics, Sintered Metals and Platings”, Wear, 7, (1964), pp. 354–367.CrossRefGoogle Scholar
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    A.R. Wayson, “A Study of Fretting on Steel”, Wear, 7, (1964) pp. 435–450.CrossRefGoogle Scholar
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    D.B. Barovich, S.C. Kingsley, and T.C. Ku, “Stresses in a Thin Strip or Slab With Different Elastic Properties From That of the Substrate Due to Elliptically Distributed Load, ” Int. J. Engng. Sci., 2, (1964) pp. 253–268.CrossRefGoogle Scholar
  6. 6.
    B.W. Mott, “Micro-Indentation Hardness Testing, ” Butterworths Scientific Publications, London, 1956.Google Scholar

Copyright information

© Plenum Press, New York 1964

Authors and Affiliations

  • R. G. Bayer
  • T. C. Ku

There are no affiliations available

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