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Product Protection Methods Summary

  • Alvin Lieberman

Abstract

All working environments can and do contain significant quantities of contaminants. Some contaminants are brought into that environment by exchange of air, movement of personnel, transport of process materials, and the like; others are generated by normal operations within the work area. It is essentially impossible to remove all contaminating materials from any area and to prevent ingression and generation of contamination into that area both while the area is in operation and even while it is quiescent. Previous chapters have shown how some contaminants are generated and brought into the work areas from the external environment. Some are generated within that work area by the materials, processes, equipment, and people in the work area. A variety of processes can transport contaminants from their source to critical locations in the cleanroom. Experience has shown that critical products must be protected from harmful contaminants. Several methods and procedures have been developed to protect products from contamination. Contamination control for product protection both before and during processing requires that the product be isolated from contaminants, protected from those that cannot be kept out of the process environment, cleaned when unavoidable contamination occurs and monitored to verify integrity of the protection processes.

Keywords

Wafer Surface Work Area Wafer Fabrication Material Handling System Semiconductor Wafer 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Van Nostrand Reinhold 1992

Authors and Affiliations

  • Alvin Lieberman

There are no affiliations available

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