Product Protection Methods Summary

  • Alvin Lieberman


All working environments can and do contain significant quantities of contaminants. Some contaminants are brought into that environment by exchange of air, movement of personnel, transport of process materials, and the like; others are generated by normal operations within the work area. It is essentially impossible to remove all contaminating materials from any area and to prevent ingression and generation of contamination into that area both while the area is in operation and even while it is quiescent. Previous chapters have shown how some contaminants are generated and brought into the work areas from the external environment. Some are generated within that work area by the materials, processes, equipment, and people in the work area. A variety of processes can transport contaminants from their source to critical locations in the cleanroom. Experience has shown that critical products must be protected from harmful contaminants. Several methods and procedures have been developed to protect products from contamination. Contamination control for product protection both before and during processing requires that the product be isolated from contaminants, protected from those that cannot be kept out of the process environment, cleaned when unavoidable contamination occurs and monitored to verify integrity of the protection processes.


Wafer Surface Work Area Wafer Fabrication Material Handling System Semiconductor Wafer 
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  1. Baker, E. J., 1989. Automation Reduces Process Equipment Particles. Microelectronics Manufacturing and Testing 12(1): 18–19.Google Scholar
  2. Briner, D., & Yeaman, M. D., 1988. Cost/Benefit Analysis of Two SMIF Alternatives Compared to a Conventional Class 10 Cleanroom. Proceedings of the 9th International Committee of Contamination Control Societies Conference, pp. 137–144, September 26, 1988. Los Angeles.Google Scholar
  3. Bruderer, J., & Schicht, H. H., 1989. Laminar Flow Protection for the Sterile Filling of Yoghurt and Other Milk Products. Swiss Contamination Control 2(l):41–45.Google Scholar
  4. Clark, R. P., & Ljungqvist, B., 1989. Containment Performance of Laboratory Fume Cupboards. Journal of R 3-Nordic 18(3):27–31.Google Scholar
  5. Cole, M., Van Ausdel, R., and Waldman, J., 1989. Improved Container and Dispense System Leads to Reduced Defects. Microcontamination 7(11):37–41.Google Scholar
  6. Cooper, D. W., 1985. Contamination Control Management: A Systems Approach. Microcontamination 3(8):49–55.Google Scholar
  7. Cranston, J. A., 1988. Tentative Standard for Protection of Electrostatic Discharge Sensitive Items: Personnel Garments. Proceedings of the 9th International Committee of Contamination Control Societies Conference, pp. 435–440, September 26, 1988, Los Angeles.Google Scholar
  8. Ellis, B. H., 1988. How Direct and Indirect Semiconductor Packaging Contamination Influences Assembly Reliability. Microcontamination 6(6):35–37.Google Scholar
  9. Frey, A. H., 1988. Using In-Duct Electrical Fields to Reduce Particulate and Gaseous Contamination. Microcontamination 6(6):27–32.MathSciNetGoogle Scholar
  10. Frieben, W. R., 1985. The Effect of Cleanroom Design and Manufacturing Systems on the Microbiological Contamination of Aseptically Filled Products. Pharmaceutical Manufacturing 2(11): 13–17.Google Scholar
  11. Gill, P., & Dillenbeck, K., 1989. Using Snake Patterns to Monitor Defects and Enhance VLSI Device Yields. Microcontamination 7(2):23–30.Google Scholar
  12. Gunawardena, S., et al., 1984. The Challenge to Control Contamination: A Novel Technique for the IC Process. Journal of Environmental Science 27(3):23–30.Google Scholar
  13. Gutacker, A. R., 1984. Localized Process and Product Contamination Control. In Contamination Control Technologist Handbook, chapter 10. Webster, NY: ARGOT, Inc.Google Scholar
  14. Hango, R. A., 1989. DI Water Quality Monitoring for Very Dense Electronic Component Manufacturing. Ultrapure Water 6(4): 14–21.Google Scholar
  15. Harper, J. G., Bailey, L. G., 1984. Flexible Material Handling Automation in Wafer Fabrication. Solid State Technology 27(7):89–98.Google Scholar
  16. Huffman, T. R., & Nichols, G. H., 1987. Reduction of Particle and ESD Damage by Room Ionization. Solid State Technology 30(11): 127–130.Google Scholar
  17. Hughes, R. A., et al., 1990. Eliminating the Cleanroom: More Experience with an Open-Area SMIF Isolation Site (OASIS). Micro contamination 8(4):35–38.Google Scholar
  18. Khan, S., 1989. Automatic Flexible Aseptic Filling and Freeze-Drying of Parenteral Drugs. Pharmaceutical Technology 13(10):24–34.Google Scholar
  19. Long, M. L., 1984. Photoresist Particle Control for VLSI Microlithography. Solid State Technology 27(3): 159–161.Google Scholar
  20. Ohmi, T., et al., 1990. Controlling Wafer Surface Contamination in Air Conditioning, Particle Removal Subsystems. Microcontamination 8(2):45–51.Google Scholar
  21. Parikh, M., & Kaemph, U., 1984. SMIF: A Technology for Wafer Cassette Transfer in VLSI Manufacturing. Solid State Technology 27(7): 111–115.Google Scholar
  22. Sayre, S., et al., 1989. SMIF Reduces Defect Density in Class 100 Production Facility. Solid State International 12(10): 104–107.Google Scholar
  23. Shon, E. M., & Hamberg, O., 1985. Packaging Films for Electronic and Space-Related Hardware. Journal of Environmental Science 28(4):46–52.Google Scholar
  24. Stemmer, K., 1983. Sterile Filling of Ampoules with Integrated Sterile Room Technology. Swiss Pharma 5(1 la):33–39.Google Scholar
  25. Stepien, T. M., 1990. An Automated System for Contamination-Controlled Processing of Precision Instruments. Journal of the Institute of Environmental Sciences 33(l):80–86.Google Scholar
  26. Stratmann, F., et al., 1988. Suppression of Particle Deposition to Surfaces by the Thermophoretic Force. Aerosol Science and Technology 9(2): 115–121.CrossRefGoogle Scholar
  27. Suzuki, M., Matsuhashi, H., & Izumoto, T., 1988. Effectiveness of Air Ionization Systems in Clean Rooms. Proceedings of the 35th Institute of Environmental Science Annual Technical Meeting, pp. 405–412, King of Prussia, PA, May 3–5, 1988.Google Scholar
  28. Titus, S., & Kelly, P., 1987. Defect Density Reduction in a Class 100 Fab Utilizing the Standard Mechanical Interface. Solid State Technology 30(11): 119–122.Google Scholar
  29. Whyte, W., 1983. A Multicentred Investigation of Clean Air Requirements for Terminally Sterilized Pharmaceuticals. Journal of Parenteral Science and Technology 37(4): 138–144.Google Scholar
  30. Woods, W. R., 1985. Experience, Problems and Subtleties of Electrostatic Discharge at JPL. Journal of Environmental Science 31(6):42–46.Google Scholar
  31. Zuck, D. S., 1984. Particle Control in the Construction of a 1 Mbit DRAM Gas Distribution System. Solid State Technology 32(11): 131–135.Google Scholar

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© Van Nostrand Reinhold 1992

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  • Alvin Lieberman

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