Surface Cleaning Methods

  • Alvin Lieberman


In any cleanroom application, the critical area most affected by contaminants is always either an exterior or an interior surface of a product. These surfaces are affected by inert and viable particles and by radiation and/or chemical film contamination. They are capable of collecting such materials continuously from any source where they may exist. For that reason, it is necessary that the product surfaces be kept clean and that any potential contamination be removed as soon as possible. Otherwise, the contaminating material can react and/or form extremely strong bonds with the critical surface material. In many present-day imaging systems, a change in surface topography as small as 0.2 μm can be detected and result in image degradation or data loss.


Wafer Surface Ultrasonic Energy Cleaning Method Particle Removal Aqueous Ozone 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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© Van Nostrand Reinhold 1992

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  • Alvin Lieberman

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