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Real-Time Super-Resolution Signal Processing Applied to the Ultrasonic Imaging of Adhesively Bonded Joints

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Abstract

The increased use of composite materials and adhesive bonding technology in the aerospace industry has increased the demand for techniques and instrumentation capable of detecting the characteristic flaws in these materials. An important class of flaws includes delaminations in composite materials and disbonds in adhesively bonded joints. These flaws may be detected using ultrasonic inspection techniques, however, in many instances the component to be inspected may only be accessed from one side, thereby requiring the use of pulse-echo ultrasonics. Using conventional techniques, delaminations are usually detected by selecting a known reflection, for instance the back surface echo, to produce a C-scan image. In order to adequately determine the criticality of a delamination, however, the depth of the flaw within the laminate must also be accurately determined.[1] This may be accomplished by sequentially acquiring and processing amplitude data that contain the front and back surface echoes.

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References

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© 1990 Springer Science+Business Media New York

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McRae, K.I., Miller, T.L., Zala, C.A., Bailey, I. (1990). Real-Time Super-Resolution Signal Processing Applied to the Ultrasonic Imaging of Adhesively Bonded Joints. In: Thompson, D.O., Chimenti, D.E. (eds) Review of Progress in Quantitative Nondestructive Evaluation. Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-5772-8_80

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  • DOI: https://doi.org/10.1007/978-1-4684-5772-8_80

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-5774-2

  • Online ISBN: 978-1-4684-5772-8

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