Dispersion Curves Analysis for Bonded Plates at Low Fd
Today the use of adhesive bonds is more developed in many industries and more specifically in Space Industries. Its development is limited by the possibility to make a non-destructive evaluation of the quality of the bond. Up to now, the inspection of the cohesion and the thickness of the glue are well controlled. With regard to the adhesion, the problem is not yet solved.
KeywordsDispersion Curve Reflection Measurement Adhesive Bond Interfacial Weakness Perfect Bond
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