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Dispersion Curves Analysis for Bonded Plates at Low Fd

  • F. Leomy
  • M. de Billy
  • G. Quentin
  • Y. Benelmostafa
  • J. F. de Belleval
  • N. Mercier
  • I. Molinero
  • D. Lecuru
Chapter
Part of the Review of Progress in Quantitative Nondestructive Evaluation book series

Abstract

Today the use of adhesive bonds is more developed in many industries and more specifically in Space Industries. Its development is limited by the possibility to make a non-destructive evaluation of the quality of the bond. Up to now, the inspection of the cohesion and the thickness of the glue are well controlled. With regard to the adhesion, the problem is not yet solved.

Keywords

Dispersion Curve Reflection Measurement Adhesive Bond Interfacial Weakness Perfect Bond 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    A Pilarski and J. L. Rosle, J. Appl. Phys. 63, 300–307 (1988).CrossRefGoogle Scholar
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    S. I. Rokhlin and D. Marom, J.A.S.A. 80, 585–590 (1986).CrossRefGoogle Scholar
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    A Pilarski, J. L. Rose and J. Da-Le, Nondestructive Testing (Proc. 12th World Conference), Amsterdam 1989.Google Scholar
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    L. M. Brekhovskikh, Waves in Layered Media, ( Academic Press, New York, 1960 ).Google Scholar
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    A. Pilarski, Mat. Eval., 43, 765–770 (1985).Google Scholar

Copyright information

© Springer Science+Business Media New York 1990

Authors and Affiliations

  • F. Leomy
    • 1
  • M. de Billy
    • 1
  • G. Quentin
    • 1
  • Y. Benelmostafa
    • 2
  • J. F. de Belleval
    • 2
  • N. Mercier
    • 2
  • I. Molinero
    • 3
  • D. Lecuru
    • 3
  1. 1.Groupe de Physique des SolidesUniversité Paris 7Paris Cedex 05France
  2. 2.Université de Technologie de CompiegneCompiégne CedexFrance
  3. 3.Centre Commun de RechercheAerospatialeSuresnes CedexFrance

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