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Thermal Wave Imaging of Nonvisible Defects in IC Devices

  • W. Lee Smith
  • C. G. Welles
  • Allan Rosencwaig
Chapter
Part of the Review of Progress in Quantitative Nondestructive Evaluation book series

Abstract

The IC industry has improved process yield and device reliability considerably over the last few years. Much of the improvement is the result of continuing reduction in the defect density on IC wafers, a result made possible in part through the use of suitable defect detection and wafer inspection systems. These systems, however, are useful only for surface or visible defects.

Keywords

Thermal Wave Subsurface Defect Bright Feature Isolation Trench Metal Defect 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1990

Authors and Affiliations

  • W. Lee Smith
    • 1
  • C. G. Welles
    • 1
  • Allan Rosencwaig
    • 1
  1. 1.Therma-Wave, Inc.FremontUSA

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