Interaction between Point-Defects, Dislocations and a Grain Boundary: A HREM Study

  • J. Thibault-Desseaux
  • J. L. Putaux
  • H. O. K. Kirchner
Part of the NATO ASI Series book series (NSSB, volume 202)


The increasing trend towards miniaturization and large scale integration of semiconductor devices has posed the challenge of producing materials which not only meet certain electronic specifications but also fulfil sometimes rather particular mechanical constraints. This implies that lattice defects created during production and materials processing of the devices have to be known and controlled. Only a microscopic and even nanoscopic knowledge of the defect structure allows the necessary stringent control of the over-all properties.


Point Defect Burger Vector Grain Boundary Screw Dislocation Misorientation Angle 


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Copyright information

© Plenum Press, New York 1989

Authors and Affiliations

  • J. Thibault-Desseaux
    • 1
  • J. L. Putaux
    • 1
  • H. O. K. Kirchner
    • 2
  1. 1.Département de Recherche Fondamentale, Service de PhysiqueCentre d’Etudes NucléairesGrenoble CedexFrance
  2. 2.Institut de Sciences des MatériauxUniversité Paris SudOrsayFrance

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