Nondestructive Characterization of Thin Adhesive Bonds

  • M. Lethiecq
  • J. C. Baboux
  • M. Perdrix


Modem cyanoacrylate adhesives are very efficient and are used more and more often to bond materials like aluminium, steel or ceramics. One of the factors that hampers their use is the problem of reproducibility of the bonds: one can never guarantee that a given bond is good, i.e. its mechanical resistance is greater that a fixed value.


Adhesive Layer Acoustical Impedance Adhesive Joint Glue Line Cyanoacrylate Adhesive 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    R.J. Schliekelmann, Non destructive testing of adhesive bonded joints, in “Adhesion and Adhesive Joints course”, C.E.I. Europe, Finspang, Sweeden (2–6 September 1985).Google Scholar
  2. 2.
    G.J. Curtis, Non destructive testing of adhesively bonded structures with acoustic methods, in: “Ultrasonic Testing”, Ed. Szilard, (1982).Google Scholar
  3. 3.
    E. Segal, J.L. Rose, Non destructive testing techniques for adhesive bond joints, in: “Research Techniques in NDT”, Ed. R.S. Sharpe (1982).Google Scholar
  4. 4.
    J.L. Rose, G.H. Thomas, The fisher linear discriminant function for adhesive bond strength prediction, in: British Journal of NDT, vol 21, n°3, (May 1979).Google Scholar
  5. 5.
    G.A. Alers, R.K. Elsley, Application of ultrasonic signal analysis to adhesive bond strength prediction, Structural Adhesives and Bonding, El Segunds, California, U.S.A. (1979).Google Scholar
  6. 6.
    M. Lethiecq, J.C. Baboux, Y. Jayet and M. Perdrix, Influence of very thin layers on transmission and reflection of ultrasonic longitudinal and shear plane waves, Ultrasonics International 85, London G.B. (July 1985).Google Scholar
  7. 7.
    A. Morineau, Panorama des méthodes d’analyse des données, in: “Cours des Journées Modulad” ENST et INRIA Paris, France (13–16 may 1986).Google Scholar

Copyright information

© Plenum Press, New York 1987

Authors and Affiliations

  • M. Lethiecq
    • 1
  • J. C. Baboux
    • 1
  • M. Perdrix
    • 1
  1. 1.Laboratoire de Traitement du Signal et Ultrasons, INSAVilleurbanne cedexFrance

Personalised recommendations