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Thermal Conductivity of a Polyimide Foam

  • D. D. Burleigh

Abstract

The thermal conductivity of a flexible polyimide closed-cell foam has been measured from 100°K to 300°K by a guarded hot plate technique (ASTM C 177). Polyimide foam is useful as an insulator from the cryogenic range through 590°K. It shows great promise for future use as a replacement for polyurethane foam.

Keywords

Thermal Conductivity Polyurethane Foam Nitrogen Purge Rigid Foam Cold Face 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Purdue Research Foundation 1985

Authors and Affiliations

  • D. D. Burleigh
    • 1
  1. 1.Materials and Process LaboratoryGeneral Dynamics Convair DivisionSan DiegoUSA

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