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Insulations with Low Thermal Conductivity

  • G. L. Copeland
  • D. L. McElroy
  • R. S. Graves
  • F. J. Weaver
  • H. A. Fine
  • T. W. Tong

Abstract

Appliances would be more energy efficient if thermal insulations could be developed with apparent thermal conductivity (λ) below 0.01 W/m·K. In an effort to identify candidate materials, λ was measured from 300 to 335 K for unevacuated and evacuated systems of angstrom- and micron-size particles.

Keywords

Fumed Silica Insulation System Solid Conduction Cabot Corporation Effective Pore Size 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Purdue Research Foundation 1985

Authors and Affiliations

  • G. L. Copeland
    • 1
  • D. L. McElroy
    • 1
  • R. S. Graves
    • 1
  • F. J. Weaver
    • 1
  • H. A. Fine
    • 2
  • T. W. Tong
    • 2
  1. 1.Martin Marietta Energy Systems, Inc. Metals and Ceramics DivisionOak Ridge National LaboratoryOak RidgeUSA
  2. 2.Department of Metallurgical Engineering and Mechanical EngineeringUniversity of KentuckyLexingtonUSA

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