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Thermal Conductance Measurements of Pressed OFHC Copper Contacts at Liquid Helium Temperatures

  • Louis J. Salerno
  • P. Kittel
  • A. L. Spivak

Abstract

The thermal conductance of pairs of oxygen-free high conductivity (OFHC) copper specimens with surface finishes ranging from 0.1 to 1.6-μm rms roughness has been investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.

Keywords

Contact Resistance Surface Finish Thermal Contact Thermal Conductance Measurement Liquid Helium Temperature 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. [1]
    Berman, R., “Some Experiments on Thermal Contact at Low Tem peratures,” J. Applied Physics 27, No. 4 (1956).Google Scholar
  2. [2]
    Bobeth, M. and Diener, G., “Variational Bounds for the Effective Thermal Contact Resistance Between Bodies with Rough Surfaces,” Int. J. Heat Mass Trnsf. 25, No. 1, 111–117 (1982).CrossRefGoogle Scholar
  3. [3]
    Jeng, D. R., “Thermal Contact Resistance in Vacuum,” J. Heat Transfer, Trans. ASME, 275–276 (1967).Google Scholar
  4. [4]
    Bobeth, M. and Diener, G., “Upper Bounds for the Effective Thermal Contact Resistance Between Bodies with Rough Surfaces,” Int. J. Heat Mass Trnsf. 25, No. 8, 1231–1238 (1982).CrossRefGoogle Scholar
  5. [5]
    Cooper, M. G., Mikiv, B. B., and Yovanovich, M. M., “Thermal Contact Conductance,” Int. J. Heat Mass Trnsf. 12, (1969).Google Scholar
  6. [6]
    Mian, M. N., Al-Astrabadi, F. R., O’Callaghan, P. W., and Probert, S. D., “Thermal Resistance of Pressed Contacts Between Steel Surfaces: Influence of Oxide Films, J. Mech. Eng. Sci. 21, No. 3 (1979).CrossRefGoogle Scholar
  7. [7]
    Mikesell, R. P. and Scott, R. B., “Heat Conduction Through Insulating Supports in Very Low Temperature Equipment,” J. Research of Natfl Bureau Standards 57, No. 6 (1956).Google Scholar
  8. [8]
    Thomas, T. R. and Probert, S. D., “Thermal Contact Resistance — the Directional Effect and Other Problems,” Int. J. Heat Mass Trnsf. 13, (1970).Google Scholar
  9. [9]
    Berman, R. and Mate, C. F., “Thermal Contact at Low Temperatures,” Nature, Dec. 13, 1958.Google Scholar
  10. [10]
    Salerno, L. J., Kittel, P., and Spivak, A. L., “Thermal Conductance of Pressed Contacts at Liquid Helium Temperatures,” AIAA Paper 83–1436 presented at AIAA 18th Thermophysics Conference, June 1–3, 1983, Montreal, Canada.Google Scholar

Copyright information

© Purdue Research Foundation 1985

Authors and Affiliations

  • Louis J. Salerno
    • 1
  • P. Kittel
    • 1
  • A. L. Spivak
    • 2
  1. 1.NASA Ames Research CenterMoffett FieldUSA
  2. 2.Trans-Bay ElectronicsRichmondUSA

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