Thermal Conductance Measurements of Pressed OFHC Copper Contacts at Liquid Helium Temperatures
The thermal conductance of pairs of oxygen-free high conductivity (OFHC) copper specimens with surface finishes ranging from 0.1 to 1.6-μm rms roughness has been investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.
KeywordsContact Resistance Surface Finish Thermal Contact Thermal Conductance Measurement Liquid Helium Temperature
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