Abstract
The thermal conductance of pairs of oxygen-free high conductivity (OFHC) copper specimens with surface finishes ranging from 0.1 to 1.6-μm rms roughness has been investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.
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© 1985 Purdue Research Foundation
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Salerno, L.J., Kittel, P., Spivak, A.L. (1985). Thermal Conductance Measurements of Pressed OFHC Copper Contacts at Liquid Helium Temperatures. In: Ashworth, T., Smith, D.R. (eds) Thermal Conductivity 18. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-4916-7_21
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DOI: https://doi.org/10.1007/978-1-4684-4916-7_21
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