Transport Properties of Polycrystalline Ni3Al

  • R. K. Williams
  • F. J. Weaver
  • R. S. Graves


Recent advances in ductilizing the intermetallic compound Ni3A1 may lead to practical applications. These applications, which are based on the outstanding strength and oxidation resistance of the compound, also require physical property data. In this paper, the room-temperature electrical and thermal conductivities of annealed high purity specimens containing 74 to 76 at. % Ni are presented and compared to theoretical predictions. Residual (4.2 K) electrical resistivity data are also employed in the analysis and these results show a pronounced minimum at the stoichiometric composition. The data show that the thermal conductivity of this compound is quite sensitive to stoichiometry and, at room temperature, has a maximum value at about 74.8 at.% Ni. Calculated and experimentally derived phonon thermal conductivity values agree well, and indicate that this carrier is responsible for about 25% of the room temperature thermal conductivity. The electronic Lorenz function is essentially equal to the Sommerfeld value.


Electrical Resistivity Seebeck Coefficient Specific Heat Data Electrical Resistivity Data Phonon Conduc 
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  1. [1]
    Bieber, G. C. and Randebaugh, R. J., “Some Age Hardening Characteristics of Nickel-Chromium Alloys (Nickel-Rich) Containing Aluminum and Titanium,” p. 417 in Precipitation from Solid Solution, American Society for Metals, 1959.Google Scholar
  2. [2]
    Copley, S. M., and Kerr, B. H., Trans. AIME 239, 977 (1967).Google Scholar
  3. [3]
    Aoki, K., and Izumi, O., Nippon Kinzoku Gakkaishi 43, 1190 (1979).Google Scholar
  4. [4]
    Liu, G. T., and Koch, C. C., “Development of Ductile Polycrystalline Ni3Al for High Temperature Applications,” p. 42 in Technical Aspects of Critical Materials Use by the Steel Industry, Vol. IIB, NBSIR 83-2679-2, Center for Materials Science, National Bureau of Standards, 1983.Google Scholar
  5. [5]
    Fluitman, J.H.J., Boom, R., de Chatel, P. F., Schinkel, C. J., Tilanns, J.L.L., and DeVries, B. R., J. Phys F: Metal. Phys. 109 (1973).Google Scholar
  6. [6]
    Williams, R. K., Graves, R. S., and Moore, J. P., ORNL-5313 (1978).Google Scholar
  7. [7]
    Dodd, C. V., Materials Evaluation XXVI, 33 (1968).Google Scholar
  8. [8]
    Jury, S. H., Arnurius, D., Godfrey, T. G., McElroy, D. L., and Moore, J. P., J. Franklin Inst. 298, 151 (1974).CrossRefGoogle Scholar
  9. [9]
    Williams, R. K., Yarbrough, D. W., Masey, J. W., Holder, T. K., and Graves, R. S., J. Appl. Phys. 52, 5167 (1981).CrossRefGoogle Scholar
  10. [10]
    Blatt, F. J., Physics of Electronic Conduction in Solids, McGraw-Hill, New York, NY (1968).Google Scholar
  11. [11]
    de Dood, W., and de Chatel, P. F., J. Phys. F: Metal. Phys. 3 1039 (1973).CrossRefGoogle Scholar
  12. [12]
    Kortekaas, T.F.M., and Franse, J., Phys. State. Sal. 40, 479 (1977).CrossRefGoogle Scholar
  13. [13]
    Williams, R. K., Graves, R. S., Hebble, T. L., McElroy, D. L., and Moore, J. P., Phys. Rev. B 26, 2932 (1982).CrossRefGoogle Scholar
  14. [14]
    Williams, R. K., Butler, W. H., Graves, R. S., and Moore, J. P., submitted to Physical Review B.Google Scholar
  15. [15]
    Callaway, J., Phys. Rev. 113, 1046 (1959).CrossRefGoogle Scholar
  16. [16]
    Roufosse, M., and Klemens, P. G., Phys. Rev. B 7 5379 (1973).CrossRefGoogle Scholar
  17. [17]
    Yarbrough, D. W., and Williams, R. K., 0RNL-5434 (1978).Google Scholar
  18. [18]
    Gschneidner, K. A., “Solid State Physics 16,” p. 275, F. Seitz and D. Turnbull, eds., Academic Press, Inc., New York, NY (1969).Google Scholar
  19. [19]
    Ho, C. Y., Ackerman, M. W., Wu, K. Y., Oh, S. G., and Havill, N. T., J. Phys. Chem. Ref. Data 7, 959 (1978).CrossRefGoogle Scholar
  20. [20]
    Williams, R. K., and Yarbrough, D. W., unpublished research.Google Scholar

Copyright information

© Purdue Research Foundation 1985

Authors and Affiliations

  • R. K. Williams
    • 1
  • F. J. Weaver
    • 1
  • R. S. Graves
    • 1
  1. 1.Metals and Ceramics DivisionOak Ridge National LaboratoryOak RidgeUSA

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