Electron Beam Microcircuit Inspection Techniques

  • Erich Kubalek
  • Eberhard Menzel
Part of the The IBM Research Symposia Series book series (IRSS)


The progressive miniaturization of integrated circuit (IC) components more and more demands micron scaled, highly sensitive and possibly nondestructive “material-microcharacterization techniques” for the recognition of the cause for the malfunction of microcircuit devices, thus improving the device fabrication process. Furthermore, the growing package density and complexity of ICs causing more difficulties in function control and failure analysis of large scale integration (LSI) and very large scale integration (VLSI) microcircuits calls for an improvement of existing and additionally the development of new testing techniques, especially enabling the direct investigation of individual IC parts and with that a localization of a possible malfunction.


Electron Beam Very Large Scale Integration Electron Beam Pulse Waveform Measurement Primary Electron Energy 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Plenum Press, New York 1984

Authors and Affiliations

  • Erich Kubalek
    • 1
  • Eberhard Menzel
    • 1
  1. 1.Werkstoffe der ElektrotechnikUniversität DuisburgDuisburgWest-Germany

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