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High Performance Cooling and Large Scale Integration

  • Robert W. Keyes
Part of the The IBM Research Symposia Series book series (IRSS)

Abstract

Large scale integration has not invaded the highest performance regime of computation. The speed of circuits on LSI chips has not matched those available at lower levels of integration. The root of the difference is to be found in power; increases in number of components have not been accompanied by a proportionate increase in power per chip. The trade-off between power and speed means that the limited ability of technology to remove heat at high density from compact structures leads to a lower power dissipation per gate at higher levels of integrations and lower speed.

Keywords

Thermal Resistance Power Dissipation Heat Current Silicon Chip Large Scale Integration 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Plenum Press, New York 1984

Authors and Affiliations

  • Robert W. Keyes
    • 1
  1. 1.IBM Thomas J. Watson Research CenterYorktown HeightsUSA

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